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To Seven Other Channels

1DIR

1A1

1B1

1OE

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2DIR

2A1

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2OE

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SN74AVC16T245

SCES551E – FEBRUARY 2004 – REVISED NOVEMBER 2015

SN74AVC16T245 16-Bit Dual-Supply Bus Transceiver

with Congurable Level-Shifting / Voltage Translation and Tri-State Outputs

1 Features 3 Description

This 16-bit noninverting bus transceiver uses two

• Control Inputs VIH/VIL Levels Are Referenced to separate congurable power-supply rails. The

VCCA Voltage SN74AVC16T245 device is optimized to operate with

• VCC Isolation Feature – If Either VCC Input Is at VCCA/VCCB set at 1.4 V to 3.6 V. The device is

GND, Both Ports Are in the High-Impedance State operational with VCCA/VCCB as low as 1.2 V. The A

port is designed to track VCCA. VCCA accepts any

• Overvoltage-Tolerant Inputs and Outputs Allow

supply voltage from 1.2 V to 3.6 V. The B port is

Mixed-Voltage-Mode Data Communications designed to track VCCB. VCCB accepts any supply

• Fully Congurable Dual-Rail Design Allows Each voltage from 1.2 V to 3.6 V. This allows for universal

Port to Operate Over the Full 1.2 V to 3.6 V low-voltage bidirectional translation between any of

Power-Supply Range the 1.2-V, 1.5-V, 1.8-V, 2.5-V, and 3.3-V voltage

• Io Supports Partial-Power-Down Mode Operation nodes.

• I/Os Are 4.6 V Tolerant The SN74AVC16T245 device is designed for

• Maximum Data Rates asynchronous communication between data buses.

The device transmits data from the A bus to the B

– 380 Mbps (1.8 V to 3.3 V Level-Shifting) bus or from the B bus to the A bus, depending on the

– 200 Mbps (<1.8 V to 3.3 V Level-Shifting) logic level at the direction-control (DIR) input. The

– 200 Mbps (Level-Shifting to 2.5 V or 1.8 V) output-enable (OE) input can be used to disable the

outputs so the buses eectively are isolated.

– 150 Mbps (Level-Shifting to 1.5 V)

– 100 Mbps (Level-Shifting to 1.2 V) The SN74AVC16T245 control pins (1DIR, 2DIR,

1OE, and 2OE) are supplied by VCCA.

• Latch-Up Performance Exceeds 100 mA Per

JESD 78, Class II Device Information(1)

• ESD Protection Exceeds JESD 22 PART NUMBER PACKAGE BODY SIZE (NOM)

– 8000-V Human-Body Model (A114-A) TSSOP (48) 12.50 mm × 6.10 mm

– 200-V Machine Model (A115-A) TVSOP (48) 9.70 mm × 4.40 mm

SN74AVC16T245

– 1000-V Charged-Device Model (C101) BGA MICROSTAR 7.00 mm × 4.50 mm

JUNIOR (56)

2 Applications (1) For all available packages, see the orderable addendum at

the end of the data sheet.

• Personal Electronics

• Industrial

• Enterprise

• Telecom

Logic Diagram (Positive Logic)

An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,

intellectual property matters and other important disclaimers. PRODUCTION DATA.

SN74AVC16T245

SCES551E –FEBRUARY 2004 – REVISED NOVEMBER 2015

www.ti.com

Table of Contents

1 Features 9 Detailed Description.................................................................. 1............................................ 13

9.1 Overview ................................................................. 13

2 Applications ........................................................... 1

9.2 Functional Block Diagram ....................................... 13

3 Description ............................................................. 1

9.3 Feature Description................................................. 13

4 Revision History..................................................... 2

9.4 Device Functional Modes........................................ 14

5 Description (continued)......................................... 310 Application and Implementation........................ 15

6 Pin Conguration and Functions ......................... 410.1 Application Information.......................................... 15

7 Specications......................................................... 510.2 Typical Application ............................................... 16

7.1 Absolute Maximum Ratings ...................................... 511 Power Supply Recommendations ..................... 18

7.2 ESD Ratings ............................................................ 512 Layout................................................................... 18

7.3 Recommended Operating Conditions ....................... 6

12.1 Layout Guidelines ................................................. 18

7.4 Thermal Information .................................................. 6

12.2 Layout Example .................................................... 19

7.5 Electrical Characteristics........................................... 7

13 Device and Documentation Support ................. 20

7.6 Switching Characteristics: V

CCA = 1.2 V ................... 8

13.1 Documentation Support ........................................ 20

7.7 Switching Characteristics: V

CCA = 1.5 V ± 0.1 V....... 8

13.2 Community Resources.......................................... 20

7.8 Switching Characteristics: V

CCA = 1.8 V ± 0.15 V .... 8

13.3 Trademarks ........................................................... 20

7.9 Switching Characteristics: V

CCA = 2.5 V ± 0.2 V....... 9

13.4 Electrostatic Discharge Caution ............................ 20

7.10 Switching Characteristics: V

CCA = 3.3 V ± 0.3 V..... 9

13.5 Glossary ................................................................ 20

7.11 Operating Characteristics........................................ 9

14 Mechanical, Packaging, and Orderable

7.12 Typical Characteristics .......................................... 10

Information ........................................................... 20

8 Parameter Measurement Information ................ 12

4 Revision History

NOTE: Page numbers for previous revisions may dier from page numbers in the current version.

Changes from Revision D (February 2015) to Revision E Page

• Updated Pin Functions Table. ............................................................................................................................................... 4

Changes from Revision C (August 2005) to Revision D Page

• Added table, section, ,ESD Ratings Feature Description Device Functional Modes Application and Implementation

section, section, section, section, andPower Supply Recommendations Layout Device and Documentation Support

Mechanical, Packaging, and Orderable Information section ................................................................................................. 1

Product Folder Links: SN74AVC16T245

SN74AVC16T245

www.ti.com

SCES551E – FEBRUARY 2004 – REVISED NOVEMBER 2015

5 Description (continued)

This device is fully specied for partial-power-down applications using Io. The Io circuitry disables the outputs,

preventing damaging current backow through the device when it is powered down.

The VCC isolation feature ensures that if either VCC input is at GND, both ports are in the high-impedance state.

To ensure the high-impedance state during power up or power down, OE should be tied to V CCA through a pullup

resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver.

Product Folder Links: SN74AVC16T245

Product specificaties

Merk:	Texas Instruments
Categorie:	Niet gecategoriseerd
Model:	SN74AVC16T245DGVR
Breedte verpakking:	449 mm
Diepte verpakking:	853 mm
Hoogte verpakking:	35 mm
Soort:	Logic IC
Type verpakking:	TVSOP
Aantal per verpakking:	2000 stuk(s)
Temperatuur bij opslag:	-65 - 150 °C
Bedrijfstemperatuur (T-T):	-40 - 85 °C
Aantal pinnen:	48