Intel DCP3700 Handleiding

Intel Solid state drives (ssd) DCP3700

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Order Number: 330566-002US

Intel® Solid-State Drive DC P3700 Series

Product Specification

Capacities: 400GB, 800GB, 1 TB, 2TB .6

Components

– Intel® 20nm MLC NAND Flash Memory

Form Factors

– 2.5-inch Form Factor

 15mm Z-height

 8639-compatible connector

– AIC Form Factor

 Half-height, Half-length

 Single slot p1-x4 connector

PCIe* Gen3 X4

Performance1,2

– Seq R/W: Up to 2800/ 00MB/s20 3

– IOPS Rnd 4KB4 70/30 : Up to 2 K R/W 65

– IOPS Rnd 4KB4 : Up to 46 K R/W 0/175

– Seq Latency (typ) R/W: 20/20µs

Operating System Support:

– Windows* Server 2012 R2, 2012,

2008 R2 x64

– RHEL* 6.5, 7.0

– UEFI 2.3.1

Reliability

– Uncorrectable Bit Error Rate (UBER):

1 sector per 1017 bits read

– Mean Time Before Failure (MTBF):

2 million hours

– T10 DIF protection

– Variable Sector Size: 512, 520, 528,

4096, 4104, 4160, 4224 Bytes

Compliance

– NVM Express* 1.0

– PCI Express Base Specification Rev 3.0

– Enterprise SSD Form Factor Version 1.0a

– PCI Express Card Electro-Mechanical

( ) Specification Rev 2.0 CEM

Certifications and Declarations

– UL*, CE*, C-Tick*, BSMI*, KCC*,

Microsoft* WHQL*, VCCI *

Power

– 2.5-inch: 3.3V and 12V Supply Rail

– AIC: 3.3V and 12V Supply Rail

– Enhanced power-loss data protection

– Active/Idle (TYP): Up to 25W/4W (TYP)

En rance Rating du

– Up to 36 PBW (Petabytes Written).5 5

10 Drive Writes/day (JESD219 workload)

Temperature Specification

– Operating:

 AIC: to 55° C ambient with 0

specified airflow

 2.5-inch: 0 to 35° C ambient,

0 to 70° C case with specified airflow

– Non-Operating6: -55 to 95° C

– Temperature monitoring (In-band and b y

way of SMBUS)

– Thermal throttling

Airflow

– AIC (55° C airflow towards IO bracket7)

 4 GB: 200 LFM 00

 800GB, 6TB, 2.0TB: 300 LFM 1.

– 2.5-inch (Airflow towards the connector)

 4 GB: 250/300 LFM (25/35° C) 00

 800GB: 350/500 LFM (25/35° C)

 1. 50/ 006TB, 2 :4TB 6 LFM (25/35° C)

Weig ht

– AIC: 400/800GB up to 185gm

1.6TB 2TB up to 195gm ,

– 2.5-inch 400/800GB up to 115gm :

1.6TB, 2TB up to 125gm

Shock

– 2.5-inch: 1,000 G/0.5msec

– AIC: 50 G Trapezoidal, 170 in/s

Vibration

– Operating: 2. G17 RMS (5-700Hz)

– Non-Operating: 3.13 GRMS -800Hz) (5

Altitude (Simulated)

 Operating: -1,000 to 10,000 ft

 Non-Operating: -1,000 to 40,000 ft

Product Ecological Compliance

– RoHS

1. Performan value vary by capacity and form factorce s

2. Performance specifications apply to both compressible and incompressible data

3. MB/s = 1,000,000 bytes/second

4. 4KB = 4,096 b es; 8KB = 8,192 bytes yt

5. 1PB = 1015 Bytes

6. Please contact your Intel representative for details on the non-operating temperature range

7. Airflow out of server through PCIe Card Slot

Intel® Solid-State Drive DC P3700 Series

Product Specification July 2014

2 330566-002US

Ordering Information

Contact your local Intel sales representative for ordering information.

INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED,

BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT AS

PROVIDED IN INTEL'S TERMS AND CON-DITIONS OF SALE FOR SUCH PRODUCTS, INTEL ASSUMES NO LIABILITY WHATSOEVER

AND INTEL DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY, RELATING TO SALE AND/OR USE OF INTEL PRODUCTS

INCLUDING LIABILITY OR WARRANTIES RELATING TO FITNESS FOR A PARTICULAR PURPOSE, MERCHANTABILITY, OR

INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT.

UNLESS OTHERWISE AGREED IN WRITING BY INTEL, THE INTEL PRODUCTS ARE NOT DESIGNED NOR INTENDED FOR ANY

APPLICATION IN WHICH THE FAILURE OF THE INTEL PRODUCT COULD CREATE A SITUATION WHERE PERSONAL INJURY OR

DEATH MAY OCCUR.

Intel may make changes to specifications and product descriptions at any time, without notice. Designers must not rely on the

absence or characteristics of any features or instructions marked "reserved" or "undefined." Intel reserves these for future

definition and shall have no responsibility whatsoever for conflicts or incompatibilities arising from future changes to them. The

information here is subject to change without notice. Do not finalize a design with this information.

The products described in this document may contain design defects or errors known as errata which may cause the product to

deviate from published specifications. Current characterized errata are available on request.

Contact your local Intel sales office or your distributor to obtain the latest specifications and before placing your product order.

This document contains information on products in the design phase of development.

Copies of documents which have an order number and are referenced in this document, or other Intel literature, may be obtained

by calling 1- - -4725, or go to: http://www.intel.com/design/literature.htmIntel and the Intel logo are trademarks of Intel 800 548

Corporation in the U.S. and other countries.

Intel® Solid-State Drive DC P3700 Series

July 2014 Product Specification

330566-002US 3

Contents

1 Overview ..................................................................................................................... 7

1.1 References ................................................................................................................... 8

1.2 Terms and Acronyms ..................................................................................................... 9

2 Product Specifications ...................................................................................................10

2.1 Capacity ..................................................................................................................... 10

2.2 Performance ................................................................................................................ 10

2.3 Electrical Characteristics ............................................................................................... 12

2.4 Environmental Conditions ............................................................................................. 13

2.5 Product Regulatory Compliance .....................................................................................15

2.6 Reliability Specifications ................................................................................................ 16

2.7 Temperature Sensor ..................................................................................................... 16

2.8 Power Loss Capacitor Test ............................................................................................. 16

2.9 Hot Plug Support ......................................................................................................... 16

2.10 Out of Band Management (SMBUS) ................................................................................ 17

2.11 Variable Sector Size Support ......................................................................................... 17

3 Mechanical Information ................................................................................................18

4 Pin and Signal Descriptions ........................................................................................... 20

4.1 2.5-inch Form Factor Pin Locations ................................................................................. 20

4.2 Pin Signal Definitions .................................................................................................... 20

5 Supported Command Sets ............................................................................................23

5.1 NVMe* Admin Command Set ......................................................................................... 23

5.2 NVMe I/O Command Set ............................................................................................... 23

5.3 Log Page Support ........................................................................................................24

5.4 SMART Attributes ......................................................................................................... 24

5.5 Temperature Statistics . ................................................................................................ 27

5.6 Drive Marketing Name Log ............................................................................................ 27

5.7 SET Feature Identifiers ................................................................................................. 27

6 NVMe Driver Support .................................................................................................... 29

7 Certifications and Declarations ....................................................................................... 30

Appendix A IDENTIFY Data Structure .................................................................................. 31

Appendix B Vital Data Structure ......................................................................................... 38

Appendix C Out of Band Temperature Sensor Read Out ........................................................39

Appendix D PCIe* ID ........................................................................................................ 40

Appendix E SCSI Command Translation .............................................................................. 41

Appendix F Add-in Card LED Decoder ................................................................................. 42

Product specificaties

Merk:	Intel
Categorie:	Solid state drives (ssd)
Model:	DCP3700
Kleur van het product:	Grijs
Gewicht:	185 g
Breedte:	- mm
Diepte:	- mm
Hoogte:	- mm
Productnaam:	Intel SSD DC P3700 Series (800GB, 1/2 Height PCIe 3.0, 20nm, MLC)
Processor lithografie:	20 nm
Certificering:	UL, CE, C-Tick, BSMI, KCC, Microsoft WHQL, VCCI
Interface:	PCI Express 3.0
Duurzaamheidscertificaten:	RoHS
Temperatuur bij opslag:	-55 - 95 °C
Intern:	Ja
SSD capaciteit:	800 GB
SSD-vormfactor:	Half-Height/Half-Length (HH/HL)
Mean time between failures (MTBF):	2000000 uur
Type geheugen:	MLC
Leessnelheid:	2800 MB/s
Schrijfsnelheid:	1900 MB/s
Maximale hoogte, in gebruik:	3048 m
Schokbestendigheid:	50 G
Trillingen, in bedrijf:	2.17 G
Trillingen bij opslag:	3.13 G
Bedrijfstemperatuur (T-T):	0 - 55 °C
Code geharmoniseerd systeem (HS):	84717070
NVMe:	Ja
Random read (4KB):	460000 IOPS
Random write (4KB):	90000 IOPS
Marktsegment:	Server
Stroomverbruik (idle):	4 W
PCI Express interface data lanes:	x4
Uncorrectable Bit Error Rate (UBER):	< 1 per 10^17 bits read
Random lezen (100% span):	460000 IOPS
Random schrijven (100% span):	90000 IOPS
Schrijflatentie:	20 µs
Leeslatentie:	20 µs
Lithografie:	20 nm
Maximum niet-operationele hoogte:	12192 m
Lanceringsdatum:	Q2'14
End-to-End Data Protection:	Ja
PCI Express CEM revisie:	2.0
Status:	Discontinued
Productfamilie:	Datacenter SSD
Productserie:	Intel DC P3700
Introductiedatum:	Q2'14
Laatste wijziging:	63903513
Productcodenaam:	Fultondale
SSD usage tagging:	Datacenter
Random lezen (8 kB):	285000 IOPS
Random schrijven (8 kB):	45000 IOPS
Enhanced Power Loss Data Protection technology:	Ja
SSD temperatuur bewaking:	Ja
Intel® High Endurance Technology (HET):	Ja
SSD ARK ID:	79626
Capaciteit drive:	800 GB
URL productsamenvatting:	http://www.intel.com/content/dam/www/public/us/en/documents/product-briefs/intel-ssd-dc-family-for-pcie-brief.pdf
SSD-uithoudingsrating:	14.6 PBW (JEDEC Workload), 10 DWPD
SSD-stroomverbruik (actief):	18W (write), 9W (read)
SSD-stroomverbruik (inactief):	4W
SSD-schok:	50 G Trapezoidal, 170 in/s
SSD-gewicht:	185gm g
Sequentiële leessnelheid:	2800 MB/s
Sequentiële schrijfsnelheid:	1900 MB/s