Intel DCP3700 Handleiding
Intel
Solid state drives (ssd)
DCP3700
Lees hieronder de 📖 handleiding in het Nederlandse voor Intel DCP3700 (42 pagina's) in de categorie Solid state drives (ssd). Deze handleiding was nuttig voor 17 personen en werd door 2 gebruikers gemiddeld met 4.5 sterren beoordeeld
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Order Number: 330566-002US
Intel® Solid-State Drive DC P3700 Series
Product Specification
Capacities: 400GB, 800GB, 1 TB, 2TB .6
Components
– Intel® 20nm MLC NAND Flash Memory
Form Factors
– 2.5-inch Form Factor
15mm Z-height
8639-compatible connector
– AIC Form Factor
Half-height, Half-length
Single slot p1-x4 connector
PCIe* Gen3 X4
Performance1,2
– Seq R/W: Up to 2800/ 00MB/s20 3
– IOPS Rnd 4KB4 70/30 : Up to 2 K R/W 65
– IOPS Rnd 4KB4 : Up to 46 K R/W 0/175
– Seq Latency (typ) R/W: 20/20µs
Operating System Support:
– Windows* Server 2012 R2, 2012,
2008 R2 x64
– RHEL* 6.5, 7.0
– UEFI 2.3.1
Reliability
– Uncorrectable Bit Error Rate (UBER):
1 sector per 1017 bits read
– Mean Time Before Failure (MTBF):
2 million hours
– T10 DIF protection
– Variable Sector Size: 512, 520, 528,
4096, 4104, 4160, 4224 Bytes
Compliance
– NVM Express* 1.0
– PCI Express Base Specification Rev 3.0
– Enterprise SSD Form Factor Version 1.0a
– PCI Express Card Electro-Mechanical
( ) Specification Rev 2.0 CEM
Certifications and Declarations
– UL*, CE*, C-Tick*, BSMI*, KCC*,
Microsoft* WHQL*, VCCI *
Power
– 2.5-inch: 3.3V and 12V Supply Rail
– AIC: 3.3V and 12V Supply Rail
– Enhanced power-loss data protection
– Active/Idle (TYP): Up to 25W/4W (TYP)
En rance Rating du
– Up to 36 PBW (Petabytes Written).5 5
10 Drive Writes/day (JESD219 workload)
Temperature Specification
– Operating:
AIC: to 55° C ambient with 0
specified airflow
2.5-inch: 0 to 35° C ambient,
0 to 70° C case with specified airflow
– Non-Operating6: -55 to 95° C
– Temperature monitoring (In-band and b y
way of SMBUS)
– Thermal throttling
Airflow
– AIC (55° C airflow towards IO bracket7)
4 GB: 200 LFM 00
800GB, 6TB, 2.0TB: 300 LFM 1.
– 2.5-inch (Airflow towards the connector)
4 GB: 250/300 LFM (25/35° C) 00
800GB: 350/500 LFM (25/35° C)
1. 50/ 006TB, 2 :4TB 6 LFM (25/35° C)
Weig ht
– AIC: 400/800GB up to 185gm
1.6TB 2TB up to 195gm ,
– 2.5-inch 400/800GB up to 115gm :
1.6TB, 2TB up to 125gm
Shock
– 2.5-inch: 1,000 G/0.5msec
– AIC: 50 G Trapezoidal, 170 in/s
Vibration
– Operating: 2. G17 RMS (5-700Hz)
– Non-Operating: 3.13 GRMS -800Hz) (5
Altitude (Simulated)
Operating: -1,000 to 10,000 ft
Non-Operating: -1,000 to 40,000 ft
Product Ecological Compliance
– RoHS
1. Performan value vary by capacity and form factorce s
2. Performance specifications apply to both compressible and incompressible data
3. MB/s = 1,000,000 bytes/second
4. 4KB = 4,096 b es; 8KB = 8,192 bytes yt
5. 1PB = 1015 Bytes
6. Please contact your Intel representative for details on the non-operating temperature range
7. Airflow out of server through PCIe Card Slot
Intel® Solid-State Drive DC P3700 Series
Product Specification July 2014
2 330566-002US
Ordering Information
Contact your local Intel sales representative for ordering information.
INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED,
BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT AS
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AND INTEL DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY, RELATING TO SALE AND/OR USE OF INTEL PRODUCTS
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INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT.
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APPLICATION IN WHICH THE FAILURE OF THE INTEL PRODUCT COULD CREATE A SITUATION WHERE PERSONAL INJURY OR
DEATH MAY OCCUR.
Intel may make changes to specifications and product descriptions at any time, without notice. Designers must not rely on the
absence or characteristics of any features or instructions marked "reserved" or "undefined." Intel reserves these for future
definition and shall have no responsibility whatsoever for conflicts or incompatibilities arising from future changes to them. The
information here is subject to change without notice. Do not finalize a design with this information.
The products described in this document may contain design defects or errors known as errata which may cause the product to
deviate from published specifications. Current characterized errata are available on request.
Contact your local Intel sales office or your distributor to obtain the latest specifications and before placing your product order.
This document contains information on products in the design phase of development.
Copies of documents which have an order number and are referenced in this document, or other Intel literature, may be obtained
by calling 1- - -4725, or go to: http://www.intel.com/design/literature.htmIntel and the Intel logo are trademarks of Intel 800 548
Corporation in the U.S. and other countries.
*Other names and brands may be claimed as the property of others. Copyright © 2014 Intel Corporation. All rights reserved.
Intel® Solid-State Drive DC P3700 Series
July 2014 Product Specification
330566-002US 3
Contents
1 Overview ..................................................................................................................... 7
1.1 References ................................................................................................................... 8
1.2 Terms and Acronyms ..................................................................................................... 9
2 Product Specifications ...................................................................................................10
2.1 Capacity ..................................................................................................................... 10
2.2 Performance ................................................................................................................ 10
2.3 Electrical Characteristics ............................................................................................... 12
2.4 Environmental Conditions ............................................................................................. 13
2.5 Product Regulatory Compliance .....................................................................................15
2.6 Reliability Specifications ................................................................................................ 16
2.7 Temperature Sensor ..................................................................................................... 16
2.8 Power Loss Capacitor Test ............................................................................................. 16
2.9 Hot Plug Support ......................................................................................................... 16
2.10 Out of Band Management (SMBUS) ................................................................................ 17
2.11 Variable Sector Size Support ......................................................................................... 17
3 Mechanical Information ................................................................................................18
4 Pin and Signal Descriptions ........................................................................................... 20
4.1 2.5-inch Form Factor Pin Locations ................................................................................. 20
4.2 Pin Signal Definitions .................................................................................................... 20
5 Supported Command Sets ............................................................................................23
5.1 NVMe* Admin Command Set ......................................................................................... 23
5.2 NVMe I/O Command Set ............................................................................................... 23
5.3 Log Page Support ........................................................................................................24
5.4 SMART Attributes ......................................................................................................... 24
5.5 Temperature Statistics . ................................................................................................ 27
5.6 Drive Marketing Name Log ............................................................................................ 27
5.7 SET Feature Identifiers ................................................................................................. 27
6 NVMe Driver Support .................................................................................................... 29
7 Certifications and Declarations ....................................................................................... 30
Appendix A IDENTIFY Data Structure .................................................................................. 31
Appendix B Vital Data Structure ......................................................................................... 38
Appendix C Out of Band Temperature Sensor Read Out ........................................................39
Appendix D PCIe* ID ........................................................................................................ 40
Appendix E SCSI Command Translation .............................................................................. 41
Appendix F Add-in Card LED Decoder ................................................................................. 42
Product specificaties
Merk: | Intel |
Categorie: | Solid state drives (ssd) |
Model: | DCP3700 |
Kleur van het product: | Grijs |
Gewicht: | 185 g |
Breedte: | - mm |
Diepte: | - mm |
Hoogte: | - mm |
Productnaam: | Intel SSD DC P3700 Series (800GB, 1/2 Height PCIe 3.0, 20nm, MLC) |
Processor lithografie: | 20 nm |
Certificering: | UL, CE, C-Tick, BSMI, KCC, Microsoft WHQL, VCCI |
Interface: | PCI Express 3.0 |
Duurzaamheidscertificaten: | RoHS |
Temperatuur bij opslag: | -55 - 95 °C |
Intern: | Ja |
SSD capaciteit: | 800 GB |
SSD-vormfactor: | Half-Height/Half-Length (HH/HL) |
Mean time between failures (MTBF): | 2000000 uur |
Type geheugen: | MLC |
Leessnelheid: | 2800 MB/s |
Schrijfsnelheid: | 1900 MB/s |
Maximale hoogte, in gebruik: | 3048 m |
Schokbestendigheid: | 50 G |
Trillingen, in bedrijf: | 2.17 G |
Trillingen bij opslag: | 3.13 G |
Bedrijfstemperatuur (T-T): | 0 - 55 °C |
Code geharmoniseerd systeem (HS): | 84717070 |
NVMe: | Ja |
Random read (4KB): | 460000 IOPS |
Random write (4KB): | 90000 IOPS |
Marktsegment: | Server |
Stroomverbruik (idle): | 4 W |
PCI Express interface data lanes: | x4 |
Uncorrectable Bit Error Rate (UBER): | < 1 per 10^17 bits read |
Random lezen (100% span): | 460000 IOPS |
Random schrijven (100% span): | 90000 IOPS |
Schrijflatentie: | 20 µs |
Leeslatentie: | 20 µs |
Lithografie: | 20 nm |
Maximum niet-operationele hoogte: | 12192 m |
Lanceringsdatum: | Q2'14 |
End-to-End Data Protection: | Ja |
PCI Express CEM revisie: | 2.0 |
Status: | Discontinued |
Productfamilie: | Datacenter SSD |
Productserie: | Intel DC P3700 |
Introductiedatum: | Q2'14 |
Laatste wijziging: | 63903513 |
Productcodenaam: | Fultondale |
SSD usage tagging: | Datacenter |
Random lezen (8 kB): | 285000 IOPS |
Random schrijven (8 kB): | 45000 IOPS |
Enhanced Power Loss Data Protection technology: | Ja |
SSD temperatuur bewaking: | Ja |
Intel® High Endurance Technology (HET): | Ja |
SSD ARK ID: | 79626 |
Capaciteit drive: | 800 GB |
URL productsamenvatting: | http://www.intel.com/content/dam/www/public/us/en/documents/product-briefs/intel-ssd-dc-family-for-pcie-brief.pdf |
SSD-uithoudingsrating: | 14.6 PBW (JEDEC Workload), 10 DWPD |
SSD-stroomverbruik (actief): | 18W (write), 9W (read) |
SSD-stroomverbruik (inactief): | 4W |
SSD-schok: | 50 G Trapezoidal, 170 in/s |
SSD-gewicht: | 185gm g |
Sequentiële leessnelheid: | 2800 MB/s |
Sequentiële schrijfsnelheid: | 1900 MB/s |
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