Texas Instruments CD4050BPWR Handleiding

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CD4049UB and CD4050B CMOS Hex Inverting Buffer and Converter

1 Features

• CD4049UB Inverting

• CD4050B Noninverting

• High Sink Current for Driving 2 TTL Loads

• High-to-Low Level Logic Conversion

• 100% Tested for Quiescent Current at 20 V

• Maximum Input Current of 1 µA at 18 V Over Full

Package Temperature Range; 100 nA at 18 V and

25°C

• 5-V, 10-V, and 15-V Parametric Ratings

2 Applications

• CMOS to DTL or TTL Hex Converters

• CMOS Current or DriversSink Source

• CMOS High-to-Low Logic Level Converters

3 Description

The CD4049UB and CD4050B devices are inverting

and noninverting hex buffers, and feature logic-level

conversion using only one supply voltage (VCC). The

input-signal high level (VIH) can exceed the VCC

supply voltage when these devices are used for logic-

level conversions. These devices are intended for use

as CMOS to DTL or TTL converters and can drive

directly two DTL or TTL loads. (VCC = 5 V,

VOL ≤ 0.4 V, and IOL ≥ 3.3 mA.)

Device Information

PART NUMBER(1) PACKAGE BODY SIZE (NOM)

CD4049UBE,

CD4050BE PDIP (16) 6.35 mm × 19.30 mm

CD4049UBD,

CD4050BD SOIC (16) 9.90 mm × 3.91 mm

CD4049UBDW,

CD4050BDW SOIC (16) 10.30 mm × 7.50 mm

CD4049UBNS,

CD4050BNS SO (16) 10.30 mm × 5.30 mm

CD4049UBPW,

CD4050BPW TSSOP (16) 5.00 mm × 4.40 mm

(1) For all available packages, see the orderable addendum at

the end of the data sheet.

OUT

Texas Instruments Incorporated

1 of 6 Identical Units

Schematic Diagram of CD4049UB

OUT

1 of 6 Identical Units

Schematic Diagram of CD4050B

CD4049UB, CD4050B

SCHS046K – AUGUST 1998 – REVISED JUNE 2020

An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,

intellectual property matters and other important disclaimers. PRODUCTION DATA.

Table of Contents

1 Features............................................................................1

2 Applications..................................................................... 1

3 Description.......................................................................1

4 Revision History.............................................................. 2

5 Pin Configuration and Functions...................................3

6 Specifications.................................................................. 4

6.1 Absolute Maximum Ratings........................................ 4

6.2 ESD Ratings............................................................... 4

6.3 Recommended Operating Conditions.........................4

6.4 Thermal Information....................................................5

6.5 Electrical Characteristics: DC..................................... 5

6.6 Electrical Characteristics: AC......................................9

6.7 Typical Characteristics.............................................. 10

7 Parameter Measurement Information.......................... 11

7.1 Test Circuits...............................................................11

8 Detailed Description......................................................13

8.1 Overview...................................................................13

8.2 Functional Block Diagram......................................... 13

8.3 Feature Description...................................................13

8.4 Device Functional Modes..........................................14

9 Application and Implementation.................................. 15

9.1 Application Information............................................. 15

9.2 Typical Application.................................................... 15

10 Power Supply Recommendations..............................16

11 Layout........................................................................... 16

11.1 Layout Guidelines................................................... 16

11.2 Layout Example...................................................... 16

12 Device and Documentation Support..........................17

12.1 Documentation Support.......................................... 17

12.2 Related Links.......................................................... 17

12.3 Receiving Notification of Documentation Updates..17

12.4 Support Resources................................................. 17

12.5 Trademarks............................................................. 17

12.6 Electrostatic Discharge Caution..............................17

12.7 Glossary..................................................................17

13 Mechanical, Packaging, and Orderable

Information.................................................................... 17

4 Revision History

NOTE: Page numbers for previous revisions may differ from page numbers in the current version.

Changes from Revision J (September 2016) to Revision K (June 2020) Page

• Updated the numbering format for tables, figures, and cross-references throughout the document..................1

• Updated Device Information Table with correct package dimensions................................................................ 1

Changes from Revision I (May 2004) to Revision J (September 2016) Page

• Added table, section, , ESD Ratings Feature Description Device Functional Modes Application and

Implementation Power Supply Recommendations Layout Device and section, section, section,

Documentation Support Mechanical, Packaging, and Orderable Information section, and section................... 1

• Deleted table; see POA at the end of the data sheet.......................................................Ordering Information 1

• Changed Storage temperature minimum value from 65 to –65..........................................................................4

• Changed RθJA values for the CD4049UB device: D (SOIC) from 73 to 81.6, DW (SOIC) from 57 to 81.6, E

(PDIP) from 67 to 49.5, NS (SO) from 64 to 84.3, and PW (TSSOP) from 108 to 108.9................................... 5

• Changed RθJA values for the CD4050B device: D (SOIC) from 73 to 81.6, DW (SOIC) from 57 to 81.2, E

(PDIP) from 67 to 49.7, NS (SO) from 64 to 83.8, and PW (TSSOP) from 108 to 108.4................................... 5

CD4049UB, CD4050B

SCHS046K – AUGUST 1998 – REVISED JUNE 2020 www.ti.com

Product Folder Links: CD4049UB CD4050B

5 Pin Configuration and Functions

1VCC 16 NC

2G 15 L

3A 14 F

4H 13 NC

5B 12 K

6I 11 E

7C 10 J

8VSS 9 D

Not to scale

Figure 5-1. CD4049UB D, DW, N, NS, and PW

Packages 16-Pin SOIC, PDIP, SO, and TSSOP Top

View

1VCC 16 NC

2G 15 L

3A 14 F

4H 13 NC

5B 12 K

6I 11 E

7C 10 J

8VSS 9 D

Not to scale

Figure 5-2. CD4050B D, DW, N, NS, and PW

Packages 1G6-Pin SOIC, PDIP, SO, and TSSOP Top

View

Pin Functions: CD4049UB

PIN I/O DESCRIPTION

NAME NO.

A 3 I Input 1

B 5 I Input 2

C 7 I Input 3

D 9 I Input 4

E 11 I Input 5

F 14 I Input 6

G 2 O Inverting output 1. G = A

H 4 O Inverting output 2. H = B

I 6 O Inverting output 3. I = C

J 10 O Inverting output 4. J = D

K 12 O Inverting output 5. K = E

L 15 O Inverting output 6. L = F

NC 13, 16 — No connection

VCC 1 — Power pin

VSS 8 — Negative supply

www.ti.com

CD4049UB, CD4050B

SCHS046K – AUGUST 1998 – REVISED JUNE 2020

Product Folder Links: CD4049UB CD4050B

Product specificaties

Merk:	Texas Instruments
Categorie:	Niet gecategoriseerd
Model:	CD4050BPWR
Breedte:	5.1 mm
Diepte:	4.5 mm
Hoogte:	1.05 mm
Breedte verpakking:	449 mm
Diepte verpakking:	853 mm
Hoogte verpakking:	35 mm
Soort:	Logic IC
Type verpakking:	TSSOP
Aantal per verpakking:	2000 stuk(s)
Temperatuur bij opslag:	-65 - 150 °C
Bedrijfstemperatuur (T-T):	-55 - 125 °C
Aantal pinnen:	16
Breedte (met pennen):	5.1 mm
Diepte (met pennen):	6.6 mm
Hoogte (met pennen):	1.2 mm