Microchip TC962 Handleiding


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2001-2012 Microchip Technology Inc. DS21484D-page 1
TC962
Features:
Pin Compatible With TC7662/ICL7662/SI7661
High Output Current 80 mA
No External Diodes Required
Wide Operating Range 3V to 18V
Low Output Impedance 28 Typ.
No Low Voltage Terminal Required
Application Zener On-Chip
OSC Frequency Doubling Pin Option for Smaller
Output Capacitors
Applications:
Laptop Computers
Disk Drives
Process Instrumentation
P-Based Controllers
Device Selection Table
General Description:
The TC962 is an advanced version of the industry
standard TC7662 high voltage DC-to-DC converter.
Using improved design techniques and CMOS
construction, the TC962 can source as much as 80 mA
versus the 7662’s 20 mA capability.
As an inverter, the TC962 can put out voltages as high
as 18V and as low as 3V without the need for external
diodes. The output impedance of the device is a low
28 (with the proper capacitors), voltage conversion
efficiency is 99.9%, and power conversion efficiency is
97%.
The low voltage terminal (pin 6) required in some
TC7662 applications has been eliminated. Grounding
this terminal will double the oscillator frequency from 12
kHz to 24 kHz. This will allow the use of smaller
capacitors for the same output current and ripple, in
most applications. Only two external capacitors are
required for inverter applications. In the event an
external clock is needed to drive the TC962 (such as
paralleling), driving this pin directly will cause the
internal oscillator to sync to the external clock.
Pin 1, which is used as a test pin on the 7662, is a
voltage reference Zener on the TC962. This Zener (6.4V
at 5 mA) has a dynamic impedance of 12 and is
intended for use where the TC962 is supplying current to
external regulator circuitry and a reference is needed for
the regulator circuit. (See Section 3.0 “Applications
Information” Applications Information).
The TC962 is compatible with the LTC1044, SI7661
and ICL7662. It should be used in designs that require
greater power and/or less input to output voltage drop.
It offers superior performance over the ICL7660S.
Package Type
Part
Number Package
Operating
Temp.
Range
TC962COE 16-Pin SOIC Wide 0°C to +70°C
TC962CPA 8-Pin Plastic DIP 0°C to +70°C
TC962EPA 8-Pin Plastic DIP -40°C to +85°C
TC962IJA 8-Pin CERDIP -25°C to +85°C
TC962MJA 8-Pin CERDIP -55°C to +125°C
VDD
1
2
3
4
5
6
7
8
16
13
12
11
10
9
NC
GND
COSC
NC
15
14
NC
NC
NC
TC962COE
NC
NC
Zener
Cathode
NC
FREQ x 2
16-Pin SOIC Wide
C+
CVOUT
1
2
3
4
8
7
6
5
FREQ x 2GND
TC962CPA
TC962EPA
TC962IJA
TC962MJA
C+
CVOUT
8-Pin CERDIP
8-Pin DIP
Zener
Cathode
COSC
VDD
High Current Charge Pump DC-to-DC Converter
TC962
DS21484D-page 2 2001-2012 Microchip Technology Inc.
Functional Block Diagram
+
Comparator
with Hysteresis
C
F/F
Q
Q
V
REF
Level
Shift
Level
Shift
Level
Shift
Level
Shift
V
DD
P SW1
CAP
C
P
External
N SW4
N SW2
N SW3
CAP
C
R
EXT
R
L
V
OUT
I I
OSC/C
Timing
Zener
Cathode
FREQ x 2
+
GND
8
2
3
OUT
5
4
7
1
6.4V
6
+
+
TC962
2001-2012 Microchip Technology Inc. DS21484D-page 3
TC962
1.0 ELECTRICAL
CHARACTERISTICS
Absolute Maximum Ratings*
Supply Voltage (VDD to GND) ..............................+18V
Input Voltage Any Pin
......................... (VDD +0.3) to (VSS -0.3) (Note 1)
Current Into Any Pin........................................... 10 mA
ESD Protection ................................................±2000V
Output Short Circuit ........... Continuous (at 5.5V Input)
Package Power Dissipation (T
A 70°C)
SOIC ....................................................... 760 mW
PDIP........................................................ 730 mW
CERDIP .................................................. 800 mW
Package Thermal Resistance
CERDIP, RJ-A .........................................90°C/W
PDIP, RJ-A ............................................ 140°C/W
Operating Temperature Range
CPA, COE ....................................... C to +70°C
IJA................................................ -25°C to +85°C
EPA .............................................. -40°C to +85°C
MJA............................................ -5C to +125°C
Storage Temperature Range .............-65°C to +150°C
*Stresses above those listed under “Absolute
Maximum Ratings” may cause permanent damage to
the device. These are stress ratings only and functional
operation of the device at these or any other conditions
above those indicated in the operation sections of the
specifications is not implied. Exposure to Absolute
Maximum Rating conditions for extended periods may
affect device reliability.
TC962 ELECTRICAL SPECIFICATIONS
Electrical Characteristics: VDD = 15V, TA = 25°C (See Figure ) unless otherwise noted.
Symbol Parameter Min Typ Max Units Test Conditions
VDD Supply Voltage 3 18 V
ISSupply Current
VDD = 15V
VDD = 5V
510
560
650
190
210
210
700
A RL =
TA = +25°C
0 T  A 70°C
-55°C TA 125°C
TA = +25°C
0 T  A 70°C
-55°C TA 125°C
ROOutput Source
Resistance
32
35
37
40
50
IL = 20 mA, VDD = 15V
IL = 80 mA, VDD = 15V
IL = 3 mA, VDD = 5V
FOSC Oscillator Frequency
12
24
kHz Pin 6 Open
Pin 6 GND
PEFF Power Efficiency 93
97
% RL = 2 k
VDEF Voltage Efficiency 99
96
99.9
% RL =
Over temperature range
VZZener Voltage 6.0 6.2 6.4 V I Z = 5 mA
ZZT Zener Impedance 12 IL = 2.5 mA to 7.5 mA
Note 1: Connecting any input terminal to voltages greater than V + or less than GND may cause destructive latch-up. It is recommended that no
inputs from sources operating from external supplies be applied prior to “power-up” of the TC962.
TC962
DS21484D-page 4 2001-2012 Microchip Technology Inc.
2.0 PIN DESCRIPTIONS
The descriptions of the pins are listed in Table 2-1.
TABLE 2-1: PIN FUNCTION TABLE
Pin No.
(8-Pin DIP)
(8-Pin CERDIP)
Symbol Description
1 Zener Cathode Cathode of internal Zener diode.
2 C+Positive side of external CP capacitor (pump cap).
3 GND Ground terminal.
4 C-Negative side of external CP capacitor (pump cap).
5 VOUT Output voltage.
6 FREQ x 2 If grounded, frequency doubles.
7 COSC Capacitor to GND will decrease frequency.
8 VDD Input voltage.
Pin No.
(16-Pin SOIC) Symbol Description
1 Zener Cathode Cathode of internal Zener diode.
2 NC No connect.
3 C+Positive side of external CP capacitor (pump cap).
4 NC No connect.
5 GND Ground terminal.
6 NC No connect.
7 C-Negative side of external CP capacitor (pump cap).
8 NC No connect.
9 NC No connect.
10 VOUT Output voltage.
11 NC No connect.
12 FREQ x 2 If grounded, frequency doubles.
13 NC No connect.
14 COSC Capacitor to GND will decrease frequency.
15 NC No connect.
16 VDD Input voltage.
2001-2012 Microchip Technology Inc. DS21484D-page 5
TC962
3.0 APPLICATIONS INFORMATION
3.1 Theory of Operation
The TC962 is a capacitive pump (sometimes called a
switched capacitor circuit), where four MOSFET
switches control the charge and discharge of a
capacitor.
The functional block diagram shows how the switching
action works. SW1 and SW2 are turned on simultane-
ously, charging CP to the supply voltage, V
IN. This
assumes that the on resistance of the MOSFETs in
series with the capacitor results in a charging time
(3 time constants) that is less than the on time provided
by the oscillator frequency as shown:
3 (RDS(ON) CP) < CP/(0.5 fOSC)
In the next cycle, SW1 and SW2 are turned off and after
a very short interval of all switches being off (this
prevents large currents from occurring due to cross
conduction), SW3 and SW4 are turned on. The charge
in CP
is then transferred to CR, but with the polarity
inverted. In this way, a negative voltage is now derived.
An oscillator supplies pulses to a flip-flop that is then
fed to a set of level shifters. These level shifters then
drive each set of switches at one-half the oscillator
frequency.
The oscillator has two pins that control the frequency of
oscillation. Pin 7 can have a capacitor added that is
returned to ground. This will lower the frequency of the
oscillator by adding capacitance to the timing capacitor
internal to the TC962. Grounding pin 6 will turn on a
current source and double the frequency. This will
double the charge current going into the internal
capacitor, as well as any capacitor added to pin 7.
A Zener diode has been added to the TC962 for use as
a reference in building external regulators. This Zener
runs from pin 1 to ground.
3.2 Latch-Up
All CMOS structures contain a parasitic SCR. Care
must be taken to prevent any input from going above or
below the supply rail, or latch-up will occur. The result
of latch-up is an effective short between V
DD and VSS.
Unless the power supply input has a current limit, this
latch-up phenomena will result in damage to the
device. (See AN763, Latch-up Protection for MOSFET
Drivers.)
FIGURE 3-1: Test Circuit
FIGURE 3-2: Typical Applications
TC962
1
2
3
4
8
690
7
5
C
P
+
10 FμC
OSC
R
L
V
OUT
(–5V)
10 Fμ
C
R
I
L
I
S
V
(+5V)
+
NC
+
1
2
3
TC962
4
8
7
6
5
C
P2
C
P1
C
R1
10 Fμ
V+
+
+
+
10 Fμ
V
OUT
= –V +
V
D1
V
D2
V
OUT
=
+
10 Fμ
Combined Negative Converter and Positive Multiplier
+
C
P
10 Fμ
+
1
2
3
4
8
7
6
5
10 Fμ
C
R
+V
OUT
= V
2
+
Split V+ In Half
TC962
Positive Voltage MultiplierLowering Output Resistance by Paralleling Devices
2V –2V
D
TC962
1
2
3
4
8
7
6
5 10 μF10 μF
V
OUT
=
+
V
D2
V
D1
++
V+
C
P
C
P
2V –2V
D
C
P1
10 μF
+C
P2
10 Fμ
+
TC962 TC962
1
2
3
4
8
7
6
5
1
2
3
4
8
7
6
5
+
V+
V
OUT
10 Fμ
C
R
V+
TC962
DS21484D-page 6 2001-2012 Microchip Technology Inc.
4.0 TYPICAL CHARACTERISTICS
Circuit of Figure , CP = CR = 10 F, CPESR CRESR 1.
Note: The graphs and tables provided following this note are a statistical summary based on a limited number of
samples and are provided for informational purposes only. The performance characteristics listed herein
are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified
operating range (e.g., outside specified power supply range) and therefore outside the warranted range.
700
600
500
400
300
200
100
-60 -40 -20 0 20 40 60 80 100 120 140
TEMPERATURE (°C)
-60 -40 -20 0 20 40 60 80 100 120 140
TEMPERATURE (°C)
SUPPLY CURRENT ( A)μ
Supply Current vs. Temperature
0
10k
1k
100
1 10 100 1000 10,000
CAPACITANCE (pF)
FREQUENCY (Hz)
Oscillator Frequency vs. C
10
OSC
T
A
= +25°C
20
18
16
14
12
10
8
FREQUENCY (kHz)
Frequency vs. Temperature
6
V = 15V
+
V = 15V
+
C
OSC
= FREQ x 2 = OPEN
-60 -40 -20 0 20 40 60 80 100 120 140
TEMPERATURE (°C)
80
70
60
50
40
30
20
OUTPUT RESISTANCE ( )
Output Resistance vs. Temperature
10
Ω
50
4.5
ZENER VOLTAGE (V)
CURRENT (mA)
Current vs. Zener Voltage
4.0 5.5 6.0 6.5 7.0
40
30
20
10
0
100
LOAD CURRENT (mA)
POWER CONVERSION EFFICIENCY (%)
Power Conversion Efficiency vs. I
16 32 48 64 80
80
60
40
20
90
70
50
30
10
0
8 24 40 56 72
LOAD
150
120
90
60
30
135
105
75
45
15
0
SUPPLY CURRENT (mA)
V = 5V IL = 3 mA
+
V = 15V IL = 20 mA
+
TA = +25°C TA = +25°C
EFFICIENCY
SUPPLY
CURRENT
100
INPUT VOLTAGE (V)
OUTPUT RESISTANCE (Ω)
Output Resistance vs. Input Voltage
4 8 12 16 20
80
60
40
20
90
70
50
30
10
2 6 10 14 180
110
T
A = +25°C
3 μA20 μA
2001-2012 Microchip Technology Inc. DS21484D-page 7
TC962
5.0 PACKAGING INFORMATION
5.1 Package Marking Information
Package marking data not available at this time.
5.2 Taping Form
5.3 Package Dimensions
Component Taping Orientation for 16-Pin SOIC (Wide) Devices
W
Pin 1
User Direction of Feed
Standard Reel Component Orientation
for 713 Suffix Device
P
Package Carrier Width (W) Pitch (P) Part Per Full Reel Reel Size
16-Pin SOIC (W) 16 mm 12 mm 1000 13 in
Carrier Tape, Number of Components Per Reel and Reel Size
.400 (10.16)
.370 (9.40)
.300 (7.62)
.230 (5.84)
.065 (1.65)
.045 (1.14)
.055 (1.40) Max. .020 (0.51) Min.
Pin 1
.200 (5.08)
.160 (4.06)
.200 (5.08)
.125 (3.18)
.110 (2.79)
.090 (2.29)
.020 (0.51)
.016 (0.41)
.040 (1.02)
.020 (0.51)
.320 (8.13)
.290 (7.37)
.150 (3.81)
Min.
3° Min.
8-Pin CDIP (Narrow)
.015 (0.38)
.008 (0.20)
.400 (10.16)
.320 (8.13)
Dimensions: inches (mm)
TC962
DS21484D-page 8 2001-2012 Microchip Technology Inc.
Package Dimensions (Continued)
3° Min.
Pin 1
.260 (6.60)
.240 (6.10)
.045 (1.14)
.030 (0.76)
.070 (1.78)
.040 (1.02)
.400 (10.16)
.348 (8.84)
.200 (5.08)
.140 (3.56)
.150 (3.81)
.115 (2.92)
.110 (2.79)
.090 (2.29)
.022 (0.56)
.015 (0.38)
.040 (1.02)
.020 (0.51) .015 (0.38)
.008 (0.20)
.310 (7.87)
.290 (7.37)
.400 (10.16)
.310 (7.87)
8-Pin Plastic DIP
Dimensions: inches (mm)
Note: For the most current package drawings, please see the Microchip Packaging Specification located
at http://www.microchip.com/packaging
Max.
Pin 1
.299 (7.59)
.291 (7.40)
.413 (10.49)
.398 (10.10)
.019 (0.48)
.014 (0.36)
.012 (0.30)
.004 (0.10)
.104 (2.64)
.097 (2.46) .013 (0.33)
.009 (0.23)
.050 (1.27)
.016 (0.40)
.419 (10.65)
.398 (10.10)
.050 (1.27) Typ.
16-Pin SOIC (Wide)
Dimensions: inches (mm)
Note: For the most current package drawings, please see the Microchip Packaging Specification located
at http://www.microchip.com/packaging
2001-2012 Microchip Technology Inc. DS21484D-page 9
TC962
6.0 REVISION HISTORY
Revision D (December 2012)
Added a note to each package outline drawing.
TC962
DS21484D-page 10 2001-2012 Microchip Technology Inc.
NOTES:
2001-2012 Microchip Technology Inc. DS21484D-page 11
TC962
THE MICROCHIP WEB SITE
Microchip provides online support via our WWW site at
www.microchip.com. This web site is used as a means
to make files and information easily available to
customers. Accessible by using your favorite Internet
browser, the web site contains the following
information:
Product Support – Data sheets and errata,
application notes and sample programs, design
resources, user’s guides and hardware support
documents, latest software releases and archived
software
General Technical Support – Frequently Asked
Questions (FAQ), technical support requests,
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ordering guides, latest Microchip press releases,
listing of seminars and events, listings of
Microchip sales offices, distributors and factory
representatives
CUSTOMER CHANGE NOTIFICATION
SERVICE
Microchip’s customer notification service helps keep
customers current on Microchip products. Subscribers
will receive e-mail notification whenever there are
changes, updates, revisions or errata related to a
specified product family or development tool of interest.
To register, access the Microchip web site at
www.microchip.com. Under “Support”, click on
“Customer Change Notification” and follow the
registration instructions.
CUSTOMER SUPPORT
Users of Microchip products can receive assistance
through several channels:
Distributor or Representative
Local Sales Office
Field Application Engineer (FAE)
Technical Support
Customers should contact their distributor,
representative or field application engineer (FAE) for
support. Local sales offices are also available to help
customers. A listing of sales offices and locations is
included in the back of this document.
Technical support is available through the web site
at: http://microchip.com/support


Product specificaties

Merk: Microchip
Categorie: Niet gecategoriseerd
Model: TC962

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