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8-Pin SOIC/MSOP/TSSOP/DIP

Evaluation Board

User’s Guide

Information contained in this publication regarding device

applications and the like is provided only for your convenience

and may be superseded by updates. It is your responsibility to

ensure that your application meets with your specifications.

MICROCHIP MAKES NO REPRESENTATIONS OR WAR-

RANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED,

WRITTEN OR ORAL, STATUTORY OR OTHERWISE,

RELATED TO THE INFORMATION, INCLUDING BUT NOT

LIMITED TO ITS CONDITION, QUALITY, PERFORMANCE,

MERCHANTABILITY OR FITNESS FOR PURPOSE.

Microchip disclaims all liability arising from this information and

its use. Use of Microchip’s products as critical components in

life support systems is not authorized except with express

written approval by Microchip. No licenses are conveyed,

implicitly or otherwise, under any Microchip intellectual property

rights.

Trademarks

The Microchip name and logo, the Microchip logo, Accuron,

dsPIC, KEELOQ, microID, MPLAB, PIC, PICmicro, PICSTART,

PRO MATE, PowerSmart, rfPIC, and SmartShunt are

registered trademarks of Microchip Technology Incorporated

in the U.S.A. and other countries.

AmpLab, FilterLab, Migratable Memory, MXDEV, MXLAB,

PICMASTER, SEEVAL, SmartSensor and The Embedded

Control Solutions Company are registered trademarks of

Microchip Technology Incorporated in the U.S.A.

Analog-for-the-Digital Age, Application Maestro, dsPICDEM,

dsPICDEM.net, dsPICworks, ECAN, ECONOMONITOR,

FanSense, FlexROM, fuzzyLAB, In-Circuit Serial

Programming, ICSP, ICEPIC, MPASM, MPLIB, MPLINK,

MPSIM, PICkit, PICDEM, PICDEM.net, PICLAB, PICtail,

PowerCal, PowerInfo, PowerMate, PowerTool, rfLAB,

rfPICDEM, Select Mode, Smart Serial, SmartTel, Total

Endurance and WiperLock are trademarks of Microchip

Technology Incorporated in the U.S.A. and other countries.

SQTP is a service mark of Microchip Technology Incorporated

in the U.S.A.

All other trademarks mentioned herein are property of their

respective companies.

Printed on recycled paper.

Note the following details of the code protection feature on Microchip devices:

• Microchip products meet the specication contained in their particular Microchip Data Sheet.

• Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the

intended manner and under normal conditions.

• There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our

knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data

Sheets. Most likely, the person doing so is engaged in theft of intellectual property.

• Microchip is willing to work with the customer who is concerned about the integrity of their code.

• Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not

mean that we are guaranteeing the product as “unbreakable.”

Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our

products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts

allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.

Microchip received ISO/TS-16949:2002 quality system certification for

its worldwide headquarters, design and wafer fabrication facilities in

Chandler and Tempe, Arizona and Mountain View, California in

October 2003. The Company’s quality system processes and

procedures are for its PICmicro® 8-bit MCUs, KEELOQ® code hopping

devices, Serial EEPROMs, microperipherals, nonvolatile memory and

analog products. In addition, Microchip’s quality system for the design

and manufacture of development systems is ISO 9001:2000 certified.

8-PIN SOIC/MSOP/TSSOP/DIP

EVALUATION BOARD USER’S GUIDE

Table of Contents

Preface ........................................................................................................................... 1

Chapter 1. Product Overview ........................................................................................ 5

1.1 Introduction ..................................................................................................... 5

1.2 What is the 8-Pin SOIC/MSOP/TSSOP/DIP Evaluation Board? .................... 5

1.3 What the 8-Pin SOIC/MSOP/TSSOP/DIP Evaluation Board Kit Includes ...... 5

Chapter 2. Installation and Operation .......................................................................... 7

2.1 Introduction ..................................................................................................... 7

2.2 Features ......................................................................................................... 7

2.3 Getting Started ............................................................................................... 8

2.4 8-Pin SOIC/MSOP/TSSOP/DIP Evaluation Board Description .................... 12

Appendix A. Schematic and Layouts ......................................................................... 19

A.1 Introduction .................................................................................................. 19

A.2 Schematics and PCB Layout ....................................................................... 19

Appendix B. Bill of Materials (BOM)........................................................................... 27

Appendix C. Microchip Analog and Interface Device Compatability ...................... 29

C.1 Introduction .................................................................................................. 29

Appendix D. Rev. 1 PCB Errata............................................. ............................. ......... 35

D.1 Introduction .................................................................................................. 35

D.2 Rev 1 PCB Issues ........................................................................................ 35

Worldwide Sales and Service .................................................................................... 38

8-Pin SOIC/MSOP/TSSOP/DIP Evaluation Board User’s Guide

NOTES:

8-PIN SOIC/MSOP/TSSOP/DIP

EVALUATION BOARD USER’S GUIDE

Preface

INTRODUCTION

This chapter contains general information that will be useful to know before using the

8-Pin SOIC/MSOP/TSSOP/DIP Evaluation Board. Items discussed in this chapter

include:

• Document Layout

• Conventions Used in this Guide

• Recommended Reading

• The Microchip Web Site

• Customer Support

• Document Revision History

DOCUMENT LAYOUT

This document describes how to use the 8-Pin SOIC/MSOP/TSSOP/DIP Evaluation

Board. The manual layout is as follows:

•Chapter 1. “Product Overview” – Important information about the 8-Pin

SOIC/MSOP/TSSOP/DIP Evaluation Board.

•Chapter 2. “Installation and Operation” – Includes instructions on how to get

started with this evaluation board.

•Appendix A. “Schematic and Layouts” – Shows the schematic and layout

diagrams for the 8-Pin SOIC/MSOP/TSSOP/DIP Evaluation Board.

•Appendix B. “Bill of Materials (BOM)” – Lists the parts used to build the 8-Pin

SOIC/MSOP/TSSOP/DIP Evaluation Board.

•Appendix C. “Microchip Analog and Interface Device Compatibility” –

Documents the Microchip Analog & Interface devices that are footprint

compatable with this PCB.

•Appendix D. “Rev. 1 PCB Errata” – Describes the PCB Errata for the Revision 1

board.

NOTICE TO CUSTOMERS

All documentation becomes dated, and this manual is no exception. Microchip tools and

documentation are constantly evolving to meet customer needs, so some actual dialogs

and/or tool descriptions may differ from those in this document. Please refer to our web site

(www.microchip.com) to obtain the latest documentation available.

Documents are identified with a “DS” number. This number is located on the bottom of each

page, in front of the page number. The numbering convention for the DS number is

“DSXXXXXA”, where “XXXXX” is the document number and “A” is the revision level of the

document.

For the most up-to-date information on development tools, see the MPLAB® IDE on-line help.

Select the Help menu, and then Topics to open a list of available on-line help files.

Preface

CUSTOMER SUPPORT

Users of Microchip products can receive assistance through several channels:

• Distributor or Representative

• Local Sales Office

• Field Application Engineer (FAE)

• Technical Support

• Development Systems Information Line

Customers should contact their distributor, representative or field application engineer

(FAE) for support. Local sales offices are also available to help customers. A listing of

sales offices and locations is included in the back of this document.

Technical support is available through the web site at: http://support.microchip.com

In addition, there is a Development Systems Information Line which lists the latest ver-

sions of Microchip's development systems software products. This line also provides

information on how customers can receive currently available upgrade kits.

The Development Systems Information Line numbers are:

1-800-755-2345 – United States and most of Canada

1-480-792-7302 – Other International Locations

DOCUMENT REVISION HISTORY

Revision A (March 2005)

• Initial Release of this Document.

8-Pin SOIC/MSOP/TSSOP/DIP Evaluation Board User’s Guide

NOTES:

8-PIN SOIC/MSOP/TSSOP/DIP

EVALUATION BOARD USER’S GUIDE

Chapter 1. Product Overview

1.1 INTRODUCTION

This chapter provides an overview of the 8-Pin SOIC/MSOP/TSSOP/DIP Evaluation

Board and covers the following topics:

• What is the 8-Pin SOIC/MSOP/TSSOP/DIP Evaluation Board?

• What the 8-Pin SOIC/MSOP/TSSOP/DIP Evaluation Board kit includes

1.2 WHAT IS THE 8-PIN SOIC/MSOP/TSSOP/DIP EVALUATION BOARD?

The 8-Pin SOIC/MSOP/TSSOP/DIP Evaluation Board allows the system designer to

quickly evaluate the operation of Microchip Technology’s devices in any of the following

8-pin packages:

• SOIC

• DIP

• MSOP

• TSSOP

Some of the Microchip family of devices that can be evaluated in the PCB include:

• A/D Converters (ADCs) (ADCs)

• Battery Chargers

• Comparators

• D/A Converters (DACs) (DACs)

• DC-to-DC Converters

• Digital Potentiometers (Digi-Pots)

• Fan Controllers

• Integrated Devices

• Interface Devices

• Linear Regulators

• Operational Amplifiers (Op Amps)

• Power MOSFET Drivers

• Programmable Gain Amplifiers (PGAs)s (PGAs)

• Switching Regulators

• Temperature Sensors

• Voltage Supervisors and Voltage Detectors

• PICmicro® Microcontrollers

1.3 WHAT THE 8-PIN SOIC/MSOP/TSSOP/DIP EVALUATION BOARD KIT

INCLUDES

This 8-Pin SOIC/MSOP/TSSOP/DIP Evaluation Board Kit includes:

• Three 8-Pin SOIC/MSOP/TSSOP/DIP Evaluation Board PCBs

• 8-Pin SOIC/MSOP/TSSOP/DIP Evaluation Board User’s Guide (DS51544)

(Electronic version on CD)

8-Pin SOIC/MSOP/TSSOP/DIP Evaluation Board User’s Guide

NOTES:

8-PIN SOIC/MSOP/TSSOP/DIP

EVALUATION BOARD USER’S GUIDE

Chapter 2. Installation and Operation

2.1 INTRODUCTION

This blank Printed Circuit Board (PCB) allows any 8-pin device in the following four

package types to be installed:

1. SOIC-8

2. PDIP-8

3. MSOP-8

4. TSSOP-8

This board is generic so that any device may be installed. Refer to the device data

sheet, however, for suitability of device evaluation.

As well as the device, other desired passive components (resistors and capacitors) and

connection posts may be installed. This allows the board to evaluate a minimum

configuration for the device. Also, this allows the device to be easily jumpered into an

existing system.

2.2 FEATURES

The 8-Pin SOIC/MSOP/TSSOP/DIP Evaluation Board has the following features:

• Connection terminals may be either through-hole or surface-mount

• Four 8-pin package footprints supported:

- SOIC

- DIP

- MSOP

- TSSOP

• Footprints for optional passive components for:

- Power supply filtering

- Device bypass capacitor

- Output filtering

- Output pull-up resistor

- Output pull-down resistor

- Output loading resistor

- Output series resistor

- Up to four additional passive components

• Silk-screen area to write specifics of implemented circuit (on back of PCB), such

as TC1232 4.75V, (to indicate that the device is the TC1232 with the 4.75V trip

point)

• PICmicro® MCU Baseline Flash Microcontroller Programmer (BFMP) Header

• Can be used for SOIC-8, MSOP-8, TSSOP-8 to DIP-8 converter

8-Pin SOIC/MSOP/TSSOP/DIP Evaluation Board User’s Guide

2.3 GETTING STARTED

The 8-Pin SOIC/MSOP/TSSOP/DIP Evaluation Board is a blank PCB that allows the

user to configure the circuit to the exact requirements. The passive components use

the surface-mount 805 package layout.

This evaluation board supports the following Microchip device families:

• A/D Converters (ADCs) (ADCs)

• Battery Chargers

• Comparators

• D/A Converters (DACs) (DACs)

• DC-to-DC Converters

• Digital Potentiometers (Digi-Pots)

• Fan Controllers

• Integrated Devices

• Interface Devices

• Linear Regulators

• Operational Amplifiers (Op Amps)

• Power MOSFET Drivers

• Programmable Gain Amplifiers (PGAs)s (PGAs)

• Switching Regulators

• Temperature Sensors

• Voltage Supervisors and Voltage Detectors

• PICmicro Microcontrollers

Figure 2-1 shows the evaluation board circuit. Pin “n” of each device (U1, U2, U3 and

U4) are tied together. These pins are then connected with pad “n” of the PCB (through

a circuit). This circuit allows each pin to individually have any of the following: a pull-up

resistor, a pull-down resistor, an in-line resistor and/or a loading/filtering capacitor.

Device-filtering capacitors are available (C2 and C3), as well as a power supply filtering

capacitor (C1).

There may be cases where some additonal passive components are desired for the

evaluation circuit. The PCB has four 805 footprints that are not connected (labled P1,

P2, P3 and P4) and can easily be jumpered into the desired circuit.

8-Pin SOIC/MSOP/TSSOP/DIP Evaluation Board User’s Guide

2.3.1 The Hardware

Figure 2-2 shows the layout of the 8-Pin SOIC/MSOP/TSSOP/DIP Evaluation Board.

This is a small four-layer board (1.5" x 2" (38.1 mm x 50.8 mm)). There are ten

connection points/pads that can use either through-hole or surface-mount connector

posts.

The pad labeled VDD is connected to the PCB power plane, while the pad labeled VSS

is connected to the PCB ground plane. All the passive components that are connected

to VDD or VSS are connected to either the power plane or ground plane.

The eight remaining PCB pads correspond to the device pins (i.e.; pad 1 connects to

pin 1).

Each pad has four passive components associated with them: a pull-up resistor, a

pull-down resistor, an in-line resistor and a filtering/load capacitor. The pull-up resistor

is always R2X, the pull-down resistor is R3X, the in-line resistor is R1X and the

filtering/load capacitor is C1X. The “X” is an alpha character that corresponds to a

particular pad (A to H). As an example, Pad 5’s pull-up resistor is R2E.

The green area of Figure 2-2 shows the silk-screen on the bottom layer of the PCB.

This is where the details of the implemented circuit can be written.

Capacitor C1 is the power supply filtering capacitor.

Capacitors C2 and C3 are bypass capacitors that may be required to be installed,

depending on the device selected and the system requirements (such as the noise

present on the power supply). Table 2-1 describes the components.

A 6-pin header interface is available that supports the PICmicro MCU Baseline Flash

Microcontroller Programmer (BFMP) interface. For additional information, refer to

Section 2.4.5 “Baseline Flash Microcontroller Programmer (BFMP) Interface

(Header J1)”.

FIGURE 2-2: 8-Pin SOIC/MSOP/TSSOP/DIP Evaluation Board Layout.

8-Pin SOIC/MSOP/TSSOP/DIP Evaluation Board User’s Guide

2.4 8-PIN SOIC/MSOP/TSSOP/DIP EVALUATION BOARD DESCRIPTION

The 8-Pin SOIC/MSOP/TSSOP/DIP Evaluation Board PCB is designed to be flexible

in the type of device evaluation that can be implemented.

The following sections describe each element of this evaluation board in further detail.

Refer to Figure 2-3.

2.4.1 Power and Ground

The 8-Pin SOIC/MSOP/TSSOP/DIP Evaluation Board has a VDD Pad and a VSS pad.

These pads can have connection posts installed that allows easy connection to the

power (VDD) and ground (VSS) planes. The layout allows either through-hole or

surface-mount connectors.

The power and ground planes are connected to the appropriate passive components

on the PCB (such as power plane to R2X and ground plane to R3X and C1X).

2.4.2 PCB PADs

For each package pin (pins 1 to 8), there is a PCB pad (pads 1 to 8). The device will

have some power pins (VDD) and some ground pins (VSS). To ease connections on the

PCB, vias to the power and ground plane have been installed close to each PCB pad.

This allows any pad to be connected to the power or ground plane, so when power is

connected to the VDD and VSS pads, the power is connected to the appropriate device

pin.

FIGURE 2-3: Jumpering the PCB pad to either VDD or VSS.

Revision 1 of this PCB has an issue that these vias are not connected to the desired

power and ground planes (they are open). For additional information, refer to

Appendix D. “Rev. 1 PCB Errata”.

Jumpering to VSS Jumpering to VDD

Installation and Operation

2.4.6 The PCB as a SOIC-8, MSOP-8, or TSSOP-8 to DIP-8 Socket

Converter

There may be occasions when it is desireable to convert the footprint of the device to

that of a DIP package. This allows the device to be installed into an exsisting DIP

socket. Two 1x4 row pins need to be installed into the PCB’s DIP footprint when the

device is installed into the appropriate package footprint.

This allows the PCB to convert the SOIC-8, MSOP-8 or TSSOP-8 footprints to a

300-mil DIP-8 footprint.

2.4.7 Evaluating a Voltage Supervisor or Voltage Detector Device

2.4.7.1 VOLTAGE SUPERVISORS

The following voltage supervisor is supported by this evaluation board.

TABLE 2-3: 8-PIN VOLTAGE SUPERVISOR

2.4.7.2 TESTING THE VOLTAGE SUPERVISORS TRIP POINT OPERATION

When evaluating a voltage supervisor/voltage detector device, a minimum set of test

equipment should be available. Table 2-4 shows the recommended test equipment.

TABLE 2-4: TEST EQUIPMENT

Device SOIC DIP MSOP TSSOP Comment

TC1232 Yes Yes — —

Hardware Connect to: Comment

Variable Power

Supply

VDD, VSS This allows the voltage to the SOT23 Evaluation Board

to be varied so the device output can be monitored.

Arbitrary Waveform

Generator

VDD, VSS This is similar to a variable power supply, but allows pro-

grammability into the input signal that the device will be

subjected to. This also allows a particular waveform to

be repeated (such as a 60 Hz sine wave that varies from

1V to 5V).

Digital Multi-Meter

(D.M.M.)

VOUT (1) Used to indicate the output state (low or high) of the

voltage supervisor/voltage detector.

Oscilloscope VOUT (1) Allows the device conditions and response to be evalu-

ated due to the ability to capture this information. This is

useful for faster signals and cases where small spikes

need to be detected.

Test Light (LED) VOUT (1) Used to visually indicate the output state (low or high) of

the voltage supervisor/voltage detector. Ensure that the

current requirements of this LED can be supplied by the

device’s output pin.

Note 1: The pad connection to connect to the V

OUT or RST pin will be dependent on the

device and the footprint option used.

8-Pin SOIC/MSOP/TSSOP/DIP Evaluation Board User’s Guide

A typical system that would be used to evaluate the voltage supervisor/voltage detector

device is shown in Figure 2-7. This also shows an example input and output waveform

for a voltage supervisor/voltage detector device.

FIGURE 2-7: Evaluation System.

Variable

Voltage R1

Test Point

Arbitrary Waveform

Generator

Output

Test

Point or

SOT-23-5/6 Evaluation Board PCB

Supervisor

Voltage

Detector

Power

Supply

Arbitrary

Waveform

Device VDD out of valid operating range.

Oscilloscope

Output voltage may be indeterminate.

Generator

VOUT

PCB

Pad

Product specificaties

Merk:	Microchip
Categorie:	Niet gecategoriseerd
Model:	TC624

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