Microchip TC624 Handleiding


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© 2005 Microchip Technology Inc. DS51544A
8-Pin SOIC/MSOP/TSSOP/DIP
Evaluation Board
Users Guide
DS51544A-page ii © 2005 Microchip Technology Inc.
Information contained in this publication regarding device
applications and the like is provided only for your convenience
and may be superseded by updates. It is your responsibility to
ensure that your application meets with your specifications.
MICROCHIP MAKES NO REPRESENTATIONS OR WAR-
RANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED,
WRITTEN OR ORAL, STATUTORY OR OTHERWISE,
RELATED TO THE INFORMATION, INCLUDING BUT NOT
LIMITED TO ITS CONDITION, QUALITY, PERFORMANCE,
MERCHANTABILITY OR FITNESS FOR PURPOSE.
Microchip disclaims all liability arising from this information and
its use. Use of Microchip’s products as critical components in
life support systems is not authorized except with express
written approval by Microchip. No licenses are conveyed,
implicitly or otherwise, under any Microchip intellectual property
rights.
Trademarks
The Microchip name and logo, the Microchip logo, Accuron,
dsPIC, KEELOQ, microID, MPLAB, PIC, PICmicro, PICSTART,
PRO MATE, PowerSmart, rfPIC, and SmartShunt are
registered trademarks of Microchip Technology Incorporated
in the U.S.A. and other countries.
AmpLab, FilterLab, Migratable Memory, MXDEV, MXLAB,
PICMASTER, SEEVAL, SmartSensor and The Embedded
Control Solutions Company are registered trademarks of
Microchip Technology Incorporated in the U.S.A.
Analog-for-the-Digital Age, Application Maestro, dsPICDEM,
dsPICDEM.net, dsPICworks, ECAN, ECONOMONITOR,
FanSense, FlexROM, fuzzyLAB, In-Circuit Serial
Programming, ICSP, ICEPIC, MPASM, MPLIB, MPLINK,
MPSIM, PICkit, PICDEM, PICDEM.net, PICLAB, PICtail,
PowerCal, PowerInfo, PowerMate, PowerTool, rfLAB,
rfPICDEM, Select Mode, Smart Serial, SmartTel, Total
Endurance and WiperLock are trademarks of Microchip
Technology Incorporated in the U.S.A. and other countries.
SQTP is a service mark of Microchip Technology Incorporated
in the U.S.A.
All other trademarks mentioned herein are property of their
respective companies.
© 2005, Microchip Technology Incorporated, Printed in the
U.S.A., All Rights Reserved.
Printed on recycled paper.
Note the following details of the code protection feature on Microchip devices:
Microchip products meet the specication contained in their particular Microchip Data Sheet.
Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the
intended manner and under normal conditions.
There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our
knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data
Sheets. Most likely, the person doing so is engaged in theft of intellectual property.
Microchip is willing to work with the customer who is concerned about the integrity of their code.
Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not
mean that we are guaranteeing the product as “unbreakable.”
Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our
products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts
allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.
Microchip received ISO/TS-16949:2002 quality system certification for
its worldwide headquarters, design and wafer fabrication facilities in
Chandler and Tempe, Arizona and Mountain View, California in
October 2003. The Company’s quality system processes and
procedures are for its PICmicro® 8-bit MCUs, KEELOQ® code hopping
devices, Serial EEPROMs, microperipherals, nonvolatile memory and
analog products. In addition, Microchip’s quality system for the design
and manufacture of development systems is ISO 9001:2000 certified.
8-PIN SOIC/MSOP/TSSOP/DIP
EVALUATION BOARD USERS GUIDE
© 2005 Microchip Technology Inc. DS51544A-page iii
Table of Contents
Preface ........................................................................................................................... 1
Chapter 1. Product Overview ........................................................................................ 5
1.1 Introduction ..................................................................................................... 5
1.2 What is the 8-Pin SOIC/MSOP/TSSOP/DIP Evaluation Board? .................... 5
1.3 What the 8-Pin SOIC/MSOP/TSSOP/DIP Evaluation Board Kit Includes ...... 5
Chapter 2. Installation and Operation .......................................................................... 7
2.1 Introduction ..................................................................................................... 7
2.2 Features ......................................................................................................... 7
2.3 Getting Started ............................................................................................... 8
2.4 8-Pin SOIC/MSOP/TSSOP/DIP Evaluation Board Description .................... 12
Appendix A. Schematic and Layouts ......................................................................... 19
A.1 Introduction .................................................................................................. 19
A.2 Schematics and PCB Layout ....................................................................... 19
Appendix B. Bill of Materials (BOM)........................................................................... 27
Appendix C. Microchip Analog and Interface Device Compatability ...................... 29
C.1 Introduction .................................................................................................. 29
Appendix D. Rev. 1 PCB Errata............................................. ............................. ......... 35
D.1 Introduction .................................................................................................. 35
D.2 Rev 1 PCB Issues ........................................................................................ 35
Worldwide Sales and Service .................................................................................... 38
8-Pin SOIC/MSOP/TSSOP/DIP Evaluation Board User’s Guide
DS51544A-page iv © 2005 Microchip Technology Inc.
NOTES:
8-PIN SOIC/MSOP/TSSOP/DIP
EVALUATION BOARD USERS GUIDE
© 2005 Microchip Technology Inc. DS51544A-page 1
Preface
INTRODUCTION
This chapter contains general information that will be useful to know before using the
8-Pin SOIC/MSOP/TSSOP/DIP Evaluation Board. Items discussed in this chapter
include:
Document Layout
Conventions Used in this Guide
Recommended Reading
The Microchip Web Site
Customer Support
Document Revision History
DOCUMENT LAYOUT
This document describes how to use the 8-Pin SOIC/MSOP/TSSOP/DIP Evaluation
Board. The manual layout is as follows:
Chapter 1. “Product Overview” – Important information about the 8-Pin
SOIC/MSOP/TSSOP/DIP Evaluation Board.
Chapter 2. “Installation and Operation” – Includes instructions on how to get
started with this evaluation board.
Appendix A. “Schematic and Layouts” – Shows the schematic and layout
diagrams for the 8-Pin SOIC/MSOP/TSSOP/DIP Evaluation Board.
Appendix B. “Bill of Materials (BOM)” – Lists the parts used to build the 8-Pin
SOIC/MSOP/TSSOP/DIP Evaluation Board.
Appendix C. “Microchip Analog and Interface Device Compatibility”
Documents the Microchip Analog & Interface devices that are footprint
compatable with this PCB.
Appendix D. “Rev. 1 PCB Errata”Describes the PCB Errata for the Revision 1
board.
NOTICE TO CUSTOMERS
All documentation becomes dated, and this manual is no exception. Microchip tools and
documentation are constantly evolving to meet customer needs, so some actual dialogs
and/or tool descriptions may differ from those in this document. Please refer to our web site
(www.microchip.com) to obtain the latest documentation available.
Documents are identified with a “DS” number. This number is located on the bottom of each
page, in front of the page number. The numbering convention for the DS number is
“DSXXXXXA”, where “XXXXX” is the document number and “A” is the revision level of the
document.
For the most up-to-date information on development tools, see the MPLAB® IDE on-line help.
Select the Help menu, and then Topics to open a list of available on-line help files.
Preface
© 2005 Microchip Technology Inc. DS51544A-page 3
CUSTOMER SUPPORT
Users of Microchip products can receive assistance through several channels:
Distributor or Representative
Local Sales Office
Field Application Engineer (FAE)
Technical Support
Development Systems Information Line
Customers should contact their distributor, representative or field application engineer
(FAE) for support. Local sales offices are also available to help customers. A listing of
sales offices and locations is included in the back of this document.
Technical support is available through the web site at: http://support.microchip.com
In addition, there is a Development Systems Information Line which lists the latest ver-
sions of Microchip's development systems software products. This line also provides
information on how customers can receive currently available upgrade kits.
The Development Systems Information Line numbers are:
1-800-755-2345 – United States and most of Canada
1-480-792-7302 – Other International Locations
DOCUMENT REVISION HISTORY
Revision A (March 2005)
Initial Release of this Document.
8-Pin SOIC/MSOP/TSSOP/DIP Evaluation Board User’s Guide
DS51544A-page 4 © 2005 Microchip Technology Inc.
NOTES:
8-PIN SOIC/MSOP/TSSOP/DIP
EVALUATION BOARD USERS GUIDE
© 2005 Microchip Technology Inc. DS51544A-page 5
Chapter 1. Product Overview
1.1 INTRODUCTION
This chapter provides an overview of the 8-Pin SOIC/MSOP/TSSOP/DIP Evaluation
Board and covers the following topics:
What is the 8-Pin SOIC/MSOP/TSSOP/DIP Evaluation Board?
What the 8-Pin SOIC/MSOP/TSSOP/DIP Evaluation Board kit includes
1.2 WHAT IS THE 8-PIN SOIC/MSOP/TSSOP/DIP EVALUATION BOARD?
The 8-Pin SOIC/MSOP/TSSOP/DIP Evaluation Board allows the system designer to
quickly evaluate the operation of Microchip Technologys devices in any of the following
8-pin packages:
• SOIC
• DIP
• MSOP
• TSSOP
Some of the Microchip family of devices that can be evaluated in the PCB include:
A/D Converters (ADCs) (ADCs)
Battery Chargers
• Comparators
D/A Converters (DACs) (DACs)
DC-to-DC Converters
Digital Potentiometers (Digi-Pots)
Fan Controllers
Integrated Devices
Interface Devices
Linear Regulators
Operational Amplifiers (Op Amps)
Power MOSFET Drivers
Programmable Gain Amplifiers (PGAs)s (PGAs)
Switching Regulators
Temperature Sensors
Voltage Supervisors and Voltage Detectors
• PICmicro® Microcontrollers
1.3 WHAT THE 8-PIN SOIC/MSOP/TSSOP/DIP EVALUATION BOARD KIT
INCLUDES
This 8-Pin SOIC/MSOP/TSSOP/DIP Evaluation Board Kit includes:
Three 8-Pin SOIC/MSOP/TSSOP/DIP Evaluation Board PCBs
8-Pin SOIC/MSOP/TSSOP/DIP Evaluation Board User’s Guide (DS51544)
(Electronic version on CD)
8-Pin SOIC/MSOP/TSSOP/DIP Evaluation Board User’s Guide
DS51544A-page 6 © 2005 Microchip Technology Inc.
NOTES:
8-PIN SOIC/MSOP/TSSOP/DIP
EVALUATION BOARD USERS GUIDE
© 2005 Microchip Technology Inc. DS51544A-page 7
Chapter 2. Installation and Operation
2.1 INTRODUCTION
This blank Printed Circuit Board (PCB) allows any 8-pin device in the following four
package types to be installed:
1. SOIC-8
2. PDIP-8
3. MSOP-8
4. TSSOP-8
This board is generic so that any device may be installed. Refer to the device data
sheet, however, for suitability of device evaluation.
As well as the device, other desired passive components (resistors and capacitors) and
connection posts may be installed. This allows the board to evaluate a minimum
configuration for the device. Also, this allows the device to be easily jumpered into an
existing system.
2.2 FEATURES
The 8-Pin SOIC/MSOP/TSSOP/DIP Evaluation Board has the following features:
Connection terminals may be either through-hole or surface-mount
Four 8-pin package footprints supported:
- SOIC
- DIP
- MSOP
- TSSOP
Footprints for optional passive components for:
- Power supply filtering
- Device bypass capacitor
- Output filtering
- Output pull-up resistor
- Output pull-down resistor
- Output loading resistor
- Output series resistor
- Up to four additional passive components
Silk-screen area to write specifics of implemented circuit (on back of PCB), such
as TC1232 4.75V, (to indicate that the device is the TC1232 with the 4.75V trip
point)
• PICmicro® MCU Baseline Flash Microcontroller Programmer (BFMP) Header
Can be used for SOIC-8, MSOP-8, TSSOP-8 to DIP-8 converter
8-Pin SOIC/MSOP/TSSOP/DIP Evaluation Board User’s Guide
DS51544A-page 8 © 2005 Microchip Technology Inc.
2.3 GETTING STARTED
The 8-Pin SOIC/MSOP/TSSOP/DIP Evaluation Board is a blank PCB that allows the
user to configure the circuit to the exact requirements. The passive components use
the surface-mount 805 package layout.
This evaluation board supports the following Microchip device families:
A/D Converters (ADCs) (ADCs)
Battery Chargers
• Comparators
D/A Converters (DACs) (DACs)
DC-to-DC Converters
Digital Potentiometers (Digi-Pots)
Fan Controllers
Integrated Devices
Interface Devices
Linear Regulators
Operational Amplifiers (Op Amps)
Power MOSFET Drivers
Programmable Gain Amplifiers (PGAs)s (PGAs)
Switching Regulators
Temperature Sensors
Voltage Supervisors and Voltage Detectors
PICmicro Microcontrollers
Figure 2-1 shows the evaluation board circuit. Pin “n” of each device (U1, U2, U3 and
U4) are tied together. These pins are then connected with pad “n” of the PCB (through
a circuit). This circuit allows each pin to individually have any of the following: a pull-up
resistor, a pull-down resistor, an in-line resistor and/or a loading/filtering capacitor.
Device-filtering capacitors are available (C2 and C3), as well as a power supply filtering
capacitor (C1).
There may be cases where some additonal passive components are desired for the
evaluation circuit. The PCB has four 805 footprints that are not connected (labled P1,
P2, P3 and P4) and can easily be jumpered into the desired circuit.
8-Pin SOIC/MSOP/TSSOP/DIP Evaluation Board User’s Guide
DS51544A-page 10 © 2005 Microchip Technology Inc.
2.3.1 The Hardware
Figure 2-2 shows the layout of the 8-Pin SOIC/MSOP/TSSOP/DIP Evaluation Board.
This is a small four-layer board (1.5" x 2" (38.1 mm x 50.8 mm)). There are ten
connection points/pads that can use either through-hole or surface-mount connector
posts.
The pad labeled VDD is connected to the PCB power plane, while the pad labeled VSS
is connected to the PCB ground plane. All the passive components that are connected
to VDD or VSS are connected to either the power plane or ground plane.
The eight remaining PCB pads correspond to the device pins (i.e.; pad 1 connects to
pin 1).
Each pad has four passive components associated with them: a pull-up resistor, a
pull-down resistor, an in-line resistor and a filtering/load capacitor. The pull-up resistor
is always R2X, the pull-down resistor is R3X, the in-line resistor is R1X and the
filtering/load capacitor is C1X. The “X” is an alpha character that corresponds to a
particular pad (A to H). As an example, Pad 5’s pull-up resistor is R2E.
The green area of Figure 2-2 shows the silk-screen on the bottom layer of the PCB.
This is where the details of the implemented circuit can be written.
Capacitor C1 is the power supply filtering capacitor.
Capacitors C2 and C3 are bypass capacitors that may be required to be installed,
depending on the device selected and the system requirements (such as the noise
present on the power supply). Table 2-1 describes the components.
A 6-pin header interface is available that supports the PICmicro MCU Baseline Flash
Microcontroller Programmer (BFMP) interface. For additional information, refer to
Section 2.4.5 “Baseline Flash Microcontroller Programmer (BFMP) Interface
(Header J1).
FIGURE 2-2: 8-Pin SOIC/MSOP/TSSOP/DIP Evaluation Board Layout.
8-Pin SOIC/MSOP/TSSOP/DIP Evaluation Board User’s Guide
DS51544A-page 12 © 2005 Microchip Technology Inc.
2.4 8-PIN SOIC/MSOP/TSSOP/DIP EVALUATION BOARD DESCRIPTION
The 8-Pin SOIC/MSOP/TSSOP/DIP Evaluation Board PCB is designed to be flexible
in the type of device evaluation that can be implemented.
The following sections describe each element of this evaluation board in further detail.
Refer to Figure 2-3.
2.4.1 Power and Ground
The 8-Pin SOIC/MSOP/TSSOP/DIP Evaluation Board has a VDD Pad and a VSS pad.
These pads can have connection posts installed that allows easy connection to the
power (VDD) and ground (VSS) planes. The layout allows either through-hole or
surface-mount connectors.
The power and ground planes are connected to the appropriate passive components
on the PCB (such as power plane to R2X and ground plane to R3X and C1X).
2.4.2 PCB PADs
For each package pin (pins 1 to 8), there is a PCB pad (pads 1 to 8). The device will
have some power pins (VDD) and some ground pins (VSS). To ease connections on the
PCB, vias to the power and ground plane have been installed close to each PCB pad.
This allows any pad to be connected to the power or ground plane, so when power is
connected to the VDD and VSS pads, the power is connected to the appropriate device
pin.
FIGURE 2-3: Jumpering the PCB pad to either VDD or VSS.
Revision 1 of this PCB has an issue that these vias are not connected to the desired
power and ground planes (they are open). For additional information, refer to
Appendix D. “Rev. 1 PCB Errata”.
Jumpering to VSS Jumpering to VDD
Installation and Operation
© 2005 Microchip Technology Inc. DS51544A-page 15
2.4.6 The PCB as a SOIC-8, MSOP-8, or TSSOP-8 to DIP-8 Socket
Converter
There may be occasions when it is desireable to convert the footprint of the device to
that of a DIP package. This allows the device to be installed into an exsisting DIP
socket. Two 1x4 row pins need to be installed into the PCB’s DIP footprint when the
device is installed into the appropriate package footprint.
This allows the PCB to convert the SOIC-8, MSOP-8 or TSSOP-8 footprints to a
300-mil DIP-8 footprint.
2.4.7 Evaluating a Voltage Supervisor or Voltage Detector Device
2.4.7.1 VOLTAGE SUPERVISORS
The following voltage supervisor is supported by this evaluation board.
TABLE 2-3: 8-PIN VOLTAGE SUPERVISOR
2.4.7.2 TESTING THE VOLTAGE SUPERVISORS TRIP POINT OPERATION
When evaluating a voltage supervisor/voltage detector device, a minimum set of test
equipment should be available. Table 2-4 shows the recommended test equipment.
TABLE 2-4: TEST EQUIPMENT
Device SOIC DIP MSOP TSSOP Comment
TC1232 Yes Yes
Hardware Connect to: Comment
Variable Power
Supply
VDD, VSS This allows the voltage to the SOT23 Evaluation Board
to be varied so the device output can be monitored.
Arbitrary Waveform
Generator
VDD, VSS This is similar to a variable power supply, but allows pro-
grammability into the input signal that the device will be
subjected to. This also allows a particular waveform to
be repeated (such as a 60 Hz sine wave that varies from
1V to 5V).
Digital Multi-Meter
(D.M.M.)
VOUT (1) Used to indicate the output state (low or high) of the
voltage supervisor/voltage detector.
Oscilloscope VOUT (1) Allows the device conditions and response to be evalu-
ated due to the ability to capture this information. This is
useful for faster signals and cases where small spikes
need to be detected.
Test Light (LED) VOUT (1) Used to visually indicate the output state (low or high) of
the voltage supervisor/voltage detector. Ensure that the
current requirements of this LED can be supplied by the
device’s output pin.
Note 1: The pad connection to connect to the V
OUT or RST pin will be dependent on the
device and the footprint option used.
8-Pin SOIC/MSOP/TSSOP/DIP Evaluation Board User’s Guide
DS51544A-page 16 © 2005 Microchip Technology Inc.
A typical system that would be used to evaluate the voltage supervisor/voltage detector
device is shown in Figure 2-7. This also shows an example input and output waveform
for a voltage supervisor/voltage detector device.
FIGURE 2-7: Evaluation System.
Variable
Voltage R1
Test Point
Arbitrary Waveform
Generator
Output
Test
Point or
SOT-23-5/6 Evaluation Board PCB
C1
Supervisor
or
Voltage
Detector
Power
Supply
or
Arbitrary
Waveform
Device VDD out of valid operating range.
Oscilloscope
Output voltage may be indeterminate.
Generator
VOUT
R2
R3
PCB
Pad


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Categorie: Niet gecategoriseerd
Model: TC624

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