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8-Pin SOIC/MSOP/TSSOP/DIP

Evaluation Board

User’s Guide

Information contained in this publication regarding device

applications and the like is provided only for your convenience

and may be superseded by updates. It is your responsibility to

ensure that your application meets with your specifications.

MICROCHIP MAKES NO REPRESENTATIONS OR WAR-

RANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED,

WRITTEN OR ORAL, STATUTORY OR OTHERWISE,

RELATED TO THE INFORMATION, INCLUDING BUT NOT

LIMITED TO ITS CONDITION, QUALITY, PERFORMANCE,

MERCHANTABILITY OR FITNESS FOR PURPOSE.

Microchip disclaims all liability arising from this information and

its use. Use of Microchip’s products as critical components in

life support systems is not authorized except with express

written approval by Microchip. No licenses are conveyed,

implicitly or otherwise, under any Microchip intellectual property

rights.

Trademarks

The Microchip name and logo, the Microchip logo, Accuron,

dsPIC, KEELOQ, microID, MPLAB, PIC, PICmicro, PICSTART,

PRO MATE, PowerSmart, rfPIC, and SmartShunt are

registered trademarks of Microchip Technology Incorporated

in the U.S.A. and other countries.

AmpLab, FilterLab, Migratable Memory, MXDEV, MXLAB,

PICMASTER, SEEVAL, SmartSensor and The Embedded

Control Solutions Company are registered trademarks of

Microchip Technology Incorporated in the U.S.A.

Analog-for-the-Digital Age, Application Maestro, dsPICDEM,

dsPICDEM.net, dsPICworks, ECAN, ECONOMONITOR,

FanSense, FlexROM, fuzzyLAB, In-Circuit Serial

Programming, ICSP, ICEPIC, MPASM, MPLIB, MPLINK,

MPSIM, PICkit, PICDEM, PICDEM.net, PICLAB, PICtail,

PowerCal, PowerInfo, PowerMate, PowerTool, rfLAB,

rfPICDEM, Select Mode, Smart Serial, SmartTel, Total

Endurance and WiperLock are trademarks of Microchip

Technology Incorporated in the U.S.A. and other countries.

SQTP is a service mark of Microchip Technology Incorporated

in the U.S.A.

All other trademarks mentioned herein are property of their

respective companies.

Printed on recycled paper.

Note the following details of the code protection feature on Microchip devices:

• Microchip products meet the specication contained in their particular Microchip Data Sheet.

• Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the

intended manner and under normal conditions.

• There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our

knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data

Sheets. Most likely, the person doing so is engaged in theft of intellectual property.

• Microchip is willing to work with the customer who is concerned about the integrity of their code.

• Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not

mean that we are guaranteeing the product as “unbreakable.”

Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our

products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts

allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.

Microchip received ISO/TS-16949:2002 quality system certification for

its worldwide headquarters, design and wafer fabrication facilities in

Chandler and Tempe, Arizona and Mountain View, California in

October 2003. The Company’s quality system processes and

procedures are for its PICmicro® 8-bit MCUs, KEELOQ® code hopping

devices, Serial EEPROMs, microperipherals, nonvolatile memory and

analog products. In addition, Microchip’s quality system for the design

and manufacture of development systems is ISO 9001:2000 certified.

8-PIN SOIC/MSOP/TSSOP/DIP

EVALUATION BOARD USER’S GUIDE

Table of Contents

Preface ........................................................................................................................... 1

Chapter 1. Product Overview ........................................................................................ 5

1.1 Introduction ..................................................................................................... 5

1.2 What is the 8-Pin SOIC/MSOP/TSSOP/DIP Evaluation Board? .................... 5

1.3 What the 8-Pin SOIC/MSOP/TSSOP/DIP Evaluation Board Kit Includes ...... 5

Chapter 2. Installation and Operation .......................................................................... 7

2.1 Introduction ..................................................................................................... 7

2.2 Features ......................................................................................................... 7

2.3 Getting Started ............................................................................................... 8

2.4 8-Pin SOIC/MSOP/TSSOP/DIP Evaluation Board Description .................... 12

Appendix A. Schematic and Layouts ......................................................................... 19

A.1 Introduction .................................................................................................. 19

A.2 Schematics and PCB Layout ....................................................................... 19

Appendix B. Bill of Materials (BOM)........................................................................... 27

Appendix C. Microchip Analog and Interface Device Compatability ...................... 29

C.1 Introduction .................................................................................................. 29

Appendix D. Rev. 1 PCB Errata............................................. ............................. ......... 35

D.1 Introduction .................................................................................................. 35

D.2 Rev 1 PCB Issues ........................................................................................ 35

Worldwide Sales and Service .................................................................................... 38

8-Pin SOIC/MSOP/TSSOP/DIP Evaluation Board User’s Guide

NOTES:

8-PIN SOIC/MSOP/TSSOP/DIP

EVALUATION BOARD USER’S GUIDE

Preface

INTRODUCTION

This chapter contains general information that will be useful to know before using the

8-Pin SOIC/MSOP/TSSOP/DIP Evaluation Board. Items discussed in this chapter

include:

• Document Layout

• Conventions Used in this Guide

• Recommended Reading

• The Microchip Web Site

• Customer Support

• Document Revision History

DOCUMENT LAYOUT

This document describes how to use the 8-Pin SOIC/MSOP/TSSOP/DIP Evaluation

Board. The manual layout is as follows:

•Chapter 1. “Product Overview” – Important information about the 8-Pin

SOIC/MSOP/TSSOP/DIP Evaluation Board.

•Chapter 2. “Installation and Operation” – Includes instructions on how to get

started with this evaluation board.

•Appendix A. “Schematic and Layouts” – Shows the schematic and layout

diagrams for the 8-Pin SOIC/MSOP/TSSOP/DIP Evaluation Board.

•Appendix B. “Bill of Materials (BOM)” – Lists the parts used to build the 8-Pin

SOIC/MSOP/TSSOP/DIP Evaluation Board.

•Appendix C. “Microchip Analog and Interface Device Compatibility” –

Documents the Microchip Analog & Interface devices that are footprint

compatable with this PCB.

•Appendix D. “Rev. 1 PCB Errata” – Describes the PCB Errata for the Revision 1

board.

NOTICE TO CUSTOMERS

All documentation becomes dated, and this manual is no exception. Microchip tools and

documentation are constantly evolving to meet customer needs, so some actual dialogs

and/or tool descriptions may differ from those in this document. Please refer to our web site

(www.microchip.com) to obtain the latest documentation available.

Documents are identified with a “DS” number. This number is located on the bottom of each

page, in front of the page number. The numbering convention for the DS number is

“DSXXXXXA”, where “XXXXX” is the document number and “A” is the revision level of the

document.

For the most up-to-date information on development tools, see the MPLAB® IDE on-line help.

Select the Help menu, and then Topics to open a list of available on-line help files.

8-Pin SOIC/MSOP/TSSOP/DIP Evaluation Board User’s Guide

CONVENTIONS USED IN THIS GUIDE

This manual uses the following documentation conventions:

RECOMMENDED READING

This blank PCB is generic and can be used with any Microchip device that is offered in

one of the following 8-pin packages:

• SOIC

• DIP

• MSOP

• TSSOP

For more information regarding devices available in these 8-pin packages, please refer

to the Microchip web site at www.microchip.com.

THE MICROCHIP WEB SITE

Microchip provides online support via our web site at www.microchip.com. This web

site is used as a means to make files and information easily available to customers.

Accessible by using your favorite Internet browser, the web site contains the following

information:

•Product Support – Data sheets and errata, application notes and sample

programs, design resources, user’s guides and hardware support documents,

latest software releases and archived software

•General Technical Support – Frequently Asked Questions (FAQs), technical

support requests, online discussion groups, Microchip consultant program

member listing

•Business of Microchip – Product selector and ordering guides, latest Microchip

press releases, listing of seminars and events, listings of Microchip sales offices,

distributors and factory representatives

DOCUMENTATION CONVENTIONS

Description Represents Examples

Arial font:

Italic characters Referenced books MPLAB® IDE User’s Guide

Emphasized text ...is the only compiler...

Preface

CUSTOMER SUPPORT

Users of Microchip products can receive assistance through several channels:

• Distributor or Representative

• Local Sales Office

• Field Application Engineer (FAE)

• Technical Support

• Development Systems Information Line

Customers should contact their distributor, representative or field application engineer

(FAE) for support. Local sales offices are also available to help customers. A listing of

sales offices and locations is included in the back of this document.

Technical support is available through the web site at: http://support.microchip.com

In addition, there is a Development Systems Information Line which lists the latest ver-

sions of Microchip's development systems software products. This line also provides

information on how customers can receive currently available upgrade kits.

The Development Systems Information Line numbers are:

1-800-755-2345 – United States and most of Canada

1-480-792-7302 – Other International Locations

DOCUMENT REVISION HISTORY

Revision A (March 2005)

• Initial Release of this Document.

8-Pin SOIC/MSOP/TSSOP/DIP Evaluation Board User’s Guide

NOTES:

8-PIN SOIC/MSOP/TSSOP/DIP

EVALUATION BOARD USER’S GUIDE

Chapter 1. Product Overview

1.1 INTRODUCTION

This chapter provides an overview of the 8-Pin SOIC/MSOP/TSSOP/DIP Evaluation

Board and covers the following topics:

• What is the 8-Pin SOIC/MSOP/TSSOP/DIP Evaluation Board?

• What the 8-Pin SOIC/MSOP/TSSOP/DIP Evaluation Board kit includes

1.2 WHAT IS THE 8-PIN SOIC/MSOP/TSSOP/DIP EVALUATION BOARD?

The 8-Pin SOIC/MSOP/TSSOP/DIP Evaluation Board allows the system designer to

quickly evaluate the operation of Microchip Technology’s devices in any of the following

8-pin packages:

• SOIC

• DIP

• MSOP

• TSSOP

Some of the Microchip family of devices that can be evaluated in the PCB include:

• A/D Converters (ADCs) (ADCs)

• Battery Chargers

• Comparators

• D/A Converters (DACs) (DACs)

• DC-to-DC Converters

• Digital Potentiometers (Digi-Pots)

• Fan Controllers

• Integrated Devices

• Interface Devices

• Linear Regulators

• Operational Amplifiers (Op Amps)

• Power MOSFET Drivers

• Programmable Gain Amplifiers (PGAs)s (PGAs)

• Switching Regulators

• Temperature Sensors

• Voltage Supervisors and Voltage Detectors

• PICmicro® Microcontrollers

1.3 WHAT THE 8-PIN SOIC/MSOP/TSSOP/DIP EVALUATION BOARD KIT

INCLUDES

This 8-Pin SOIC/MSOP/TSSOP/DIP Evaluation Board Kit includes:

• Three 8-Pin SOIC/MSOP/TSSOP/DIP Evaluation Board PCBs

• 8-Pin SOIC/MSOP/TSSOP/DIP Evaluation Board User’s Guide (DS51544)

(Electronic version on CD)

8-Pin SOIC/MSOP/TSSOP/DIP Evaluation Board User’s Guide

NOTES:

8-Pin SOIC/MSOP/TSSOP/DIP Evaluation Board User’s Guide

2.3 GETTING STARTED

The 8-Pin SOIC/MSOP/TSSOP/DIP Evaluation Board is a blank PCB that allows the

user to configure the circuit to the exact requirements. The passive components use

the surface-mount 805 package layout.

This evaluation board supports the following Microchip device families:

• A/D Converters (ADCs) (ADCs)

• Battery Chargers

• Comparators

• D/A Converters (DACs) (DACs)

• DC-to-DC Converters

• Digital Potentiometers (Digi-Pots)

• Fan Controllers

• Integrated Devices

• Interface Devices

• Linear Regulators

• Operational Amplifiers (Op Amps)

• Power MOSFET Drivers

• Programmable Gain Amplifiers (PGAs)s (PGAs)

• Switching Regulators

• Temperature Sensors

• Voltage Supervisors and Voltage Detectors

• PICmicro Microcontrollers

Figure 2-1 shows the evaluation board circuit. Pin “n” of each device (U1, U2, U3 and

U4) are tied together. These pins are then connected with pad “n” of the PCB (through

a circuit). This circuit allows each pin to individually have any of the following: a pull-up

resistor, a pull-down resistor, an in-line resistor and/or a loading/filtering capacitor.

Device-filtering capacitors are available (C2 and C3), as well as a power supply filtering

capacitor (C1).

There may be cases where some additonal passive components are desired for the

evaluation circuit. The PCB has four 805 footprints that are not connected (labled P1,

P2, P3 and P4) and can easily be jumpered into the desired circuit.

Installation and Operation

FIGURE 2-1: 8-Pin SOIC/MSOP/TSSOP/DIP Evaluation Board Circuit.

8C1G*

R2G*

R3G* R1G* (3)

C1H*

R2H*

R3H* R1H* (3)

PAD7

PAD8

C1E*

R2E*

R3E* R1E* (3)

C1F*

R2F*

R3F* R1F* (3)

PAD5

PAD6

C1A*

R2A*

R3A*

R1A* (3)

PAD1

C1B*

R2B*

R3B*

R1B* (3)

PAD2

C1C*

R2C*

R3C*

R1C* (3)

PAD3

C1D*

R2D*

R3D*

R1D* (3)

PAD4 C2 (2)

VDD

VSS

To power plane

To ground plane

VSS VDD

C3 (2)

VDD VSS

C1 (2)

P1 (1)

TP11 TP12

(1)

TP13 TP14

P3 (1)

TP15 TP16

(1)

TP17 TP18

* Optional components, circuit-dependent.

Note 1: Can be any passive component (R, C, ...) that fits onto a 805 surface-mount footprint.

2: Optional power/device filtering capacitors.

3: When installing this component, ensure to cut the trace between the two pads of the device.

8-Pin SOIC/MSOP/TSSOP/DIP Evaluation Board User’s Guide

2.3.1 The Hardware

Figure 2-2 shows the layout of the 8-Pin SOIC/MSOP/TSSOP/DIP Evaluation Board.

This is a small four-layer board (1.5" x 2" (38.1 mm x 50.8 mm)). There are ten

connection points/pads that can use either through-hole or surface-mount connector

posts.

The pad labeled VDD is connected to the PCB power plane, while the pad labeled VSS

is connected to the PCB ground plane. All the passive components that are connected

to VDD or VSS are connected to either the power plane or ground plane.

The eight remaining PCB pads correspond to the device pins (i.e.; pad 1 connects to

pin 1).

Each pad has four passive components associated with them: a pull-up resistor, a

pull-down resistor, an in-line resistor and a filtering/load capacitor. The pull-up resistor

is always R2X, the pull-down resistor is R3X, the in-line resistor is R1X and the

filtering/load capacitor is C1X. The “X” is an alpha character that corresponds to a

particular pad (A to H). As an example, Pad 5’s pull-up resistor is R2E.

The green area of Figure 2-2 shows the silk-screen on the bottom layer of the PCB.

This is where the details of the implemented circuit can be written.

Capacitor C1 is the power supply filtering capacitor.

Capacitors C2 and C3 are bypass capacitors that may be required to be installed,

depending on the device selected and the system requirements (such as the noise

present on the power supply). Table 2-1 describes the components.

A 6-pin header interface is available that supports the PICmicro MCU Baseline Flash

Microcontroller Programmer (BFMP) interface. For additional information, refer to

Section 2.4.5 “Baseline Flash Microcontroller Programmer (BFMP) Interface

(Header J1)”.

FIGURE 2-2: 8-Pin SOIC/MSOP/TSSOP/DIP Evaluation Board Layout.

Installation and Operation

TABLE 2-1: OPTIONAL PASSIVE COMPONENTS

Device Comment

C1 Power supply bypass capacitor

C2, C3 Device Filtering capacitor

C1A, C1B C1C, C1D, C1E, C1F, C1G, C1H Output filter capacitor

R1A, R1B, R1C, R1D, R1E, R1F, R1G, R1H In-line resistance of device output

R2A, R2B, R2C, R2D, R2E, R2F, R2G, R2H Pull-up resistor

R3A, R3B, R3C, R3D, R3E, R3F, R3G, R3H Pull-down resistor

P1, P2, P3, P4 Optional Passive Components

8-Pin SOIC/MSOP/TSSOP/DIP Evaluation Board User’s Guide

2.4 8-PIN SOIC/MSOP/TSSOP/DIP EVALUATION BOARD DESCRIPTION

The 8-Pin SOIC/MSOP/TSSOP/DIP Evaluation Board PCB is designed to be flexible

in the type of device evaluation that can be implemented.

The following sections describe each element of this evaluation board in further detail.

Refer to Figure 2-3.

2.4.1 Power and Ground

The 8-Pin SOIC/MSOP/TSSOP/DIP Evaluation Board has a VDD Pad and a VSS pad.

These pads can have connection posts installed that allows easy connection to the

power (VDD) and ground (VSS) planes. The layout allows either through-hole or

surface-mount connectors.

The power and ground planes are connected to the appropriate passive components

on the PCB (such as power plane to R2X and ground plane to R3X and C1X).

2.4.2 PCB PADs

For each package pin (pins 1 to 8), there is a PCB pad (pads 1 to 8). The device will

have some power pins (VDD) and some ground pins (VSS). To ease connections on the

PCB, vias to the power and ground plane have been installed close to each PCB pad.

This allows any pad to be connected to the power or ground plane, so when power is

connected to the VDD and VSS pads, the power is connected to the appropriate device

pin.

FIGURE 2-3: Jumpering the PCB pad to either VDD or VSS.

Revision 1 of this PCB has an issue that these vias are not connected to the desired

power and ground planes (they are open). For additional information, refer to

Appendix D. “Rev. 1 PCB Errata”.

Jumpering to VSS Jumpering to VDD

Installation and Operation

2.4.3 Passive Components (R1X, R2X, R3X, C1X, R1, R2, C1, C2, C3,

P1, P2, P3 and P4)

The footprints for these components are present to allow maximum flexibility in the use

of this PCB to evaluate a wide range of SOT-23-3 devices. The purpose of these

components may vary depending on the device under evaluation and how it is to be

used in the desired circuit. Refer to the device data sheet for the recommended

components that should be used when evaluating that device.

• Component R1X allows an in-line resistor that can be installed between the

device pin and the PCB pad. This may be required when interfacing this PCB to

other circuits

• Component R2X allows a pull-up resistor to be installed for the device pin

• Component R3X allows a pull-down resistor to be installed for the device pin

• Component C1X allows a capacitive load/filter to be installed for the device pin

• Component C1 allows a power supply filtering capacitor to be installed

• Components C2 and C3 allows a device filtering capacitor to be installed

• Components P1, P2, P3, and P4 are not connected and give a footprint (805

surface-mount) for a passive component (resistor, capacitor, etc.) to be installed

and jumpered into the PCB circuit. This allows for the evaluation of some simple

device circuits to be implemented on this PCB

2.4.4 Installing Resistor R1X

Resistor R1X is shorted by default. Therefore, if resistor R1X is to be installed, the trace

across the component must be cut before it is installed (see Figure 2-4).

While evaluating a device, it may be desireable to see the signals on both sides of this

resistor. A test point is available so that both signals may be monitored. This test point

is the avenue between components R3X and C1X (see Figure 2-4).

FIGURE 2-4: Test point when resistor R1X is installed.

This trace must be cut

before resistor R1X can be installed

Test point

8-Pin SOIC/MSOP/TSSOP/DIP Evaluation Board User’s Guide

2.4.5 Baseline Flash Microcontroller Programmer (BFMP) Interface

(Header J1)

The BFMP interface allows a PICmicro MCU device to be programmed with

programmers that support this interface, such as the BFMP programmer (part number

PG164101).

The PCB supports two device pinouts. The default pinout already has the traces

connected to the appropriate PICmicro MCU pins. The optional pinout requires three

PCB traces to be cut and then three connections to be made (see Figure 2-5).

TABLE 2-2: BFMP HEADER SIGNALS AND PICMICRO MCU PINS

FIGURE 2-5: BFMP Header and Connections

FIGURE 2-6: PCB Traces (Top and Bottom Layers).

BFMP

Header

Signal

Pin Number

Comment

Default

Pinout

Optional

Pinout (1)

CLK 6 4 ICSP™ Clock

DT 7 5 ICSP Data

VPP 4 8

Note 1: Requires PCB traces to be cut and then jumpered.

Required “Cuts” and “Jumpers” for Optional

PICmicro® MCU pinout

Top-Layer Traces Bottom-Layer Traces

8-PIN SOIC/MSOP/TSSOP/DIP

EVALUATION BOARD USER’S GUIDE

Appendix B. Bill of Materials (BOM)

TABLE B-1: BILL OF MATERIALS

Qty Reference Description Manufacturer Part Number

1 PCB 103-00050 SOT23 Evaluation Board PCB Microchip

Technology Inc.

103-00060

0 U1 SOIC-8 Device Microchip

Technology Inc.

User-specified

0 U2 MSOP-8 Device Microchip

Technology Inc.

User-specified

0 U3 DIP-8 Device Microchip

Technology Inc.

User-specified

0 U4 TSSOP-8 Device Microchip

Technology Inc.

User-specified

0 C1, C2, C3 Device Power Supply Bypass Capacitor

Surface-mount (805 package)

(Optional - Application-dependent)

— User-specied

0 C1A, C1B, C1C,

C1D, C1E, C1F,

C1G, C1H

Output Filer Capacitor

Surface-mount (805 package)

(Optional - Application-dependent)

— User-specied

0 R1A, R1B, R1C,

R1D, R1E, R1F,

R1G, R1H

Output inline resistor

Surface-mount (805 package)

(Optional - Application-dependent)

— User-specied

0 R2A, R2B, R2C,

R2D, R2E, R2F,

R2G, R2H

Output Pull-up resistor

Surface-mount (805 package)

(Optional - Application-dependent)

— User-specied

0 R3A, R3B, R3C,

R3D, R3E, R3F,

R3G, R3H

Output Pull-down resistor

Surface-mount (805 package)

(Optional - Application-dependent)

— User-specied

0 P1, P2, P3, P4 Passive component (not connected) that can be

“blue wired” into the desired circuit. The device

layout supports the 805 package.

(Optional - Application-dependent)

0 J1 BFMP Header (6-pin, 100 mil spacing) — —

0 PAD1, PAD2, PAD3,

PAD4, PAD5, PAD6,

PAD7, PAD8,

VDD, VSS

Through-hole connector(s) for PAD1, PAD2,

PAD3, PAD4, PAD5, PAD6, PAD7, PAD8, VDD,

VSS

Keystone

Electronics®

5012

0 PAD1, PAD2, PAD3,

PAD4, PAD5, PAD6,

PAD7, PAD8,

VDD, VSS

Surface-mount connector(s) for PAD1, PAD2,

PAD3, PAD4, PAD5, PAD6, PAD7, PAD8, VDD,

VSS

Keystone

Electronics®

5016

Product specificaties

Merk:	Microchip
Categorie:	Niet gecategoriseerd
Model:	TC624

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