Microchip PIC16F737 Handleiding

Microchip Niet gecategoriseerd PIC16F737

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CONTENTS

1.0 Introduction ......................................................... 1

2.0 MPLAB ICE 2000 System................................... 1

3.0 Emulator-Related Issues .................................... 2

4.0 Processor Modules ............................................. 2

5.0 Device Adapters ................................................. 4

6.0 Device Adapter Target Footprints ....................... 9

1.0 INTRODUCTION

The processor modules for MPLAB® ICE 2000 are

interchangeable personality modules that allow

MPLAB ICE 2000 to be reconfigured for emulation of

different PIC® microcontrollers (MCUs). This modular-

ity allows the emulation of many different devices with

the addition of a processor module and device adapter,

which provides a very cost effective multiprocessor

emulation system.

The device adapters for MPLAB ICE 2000 are inter-

changeable assemblies that allow the emulator system

to interface to a target application system. Device

adapters also have control logic that allows the target

application to provide a clock source and power to the

processor module. The device adapters support PIC

MCUs in DIP, SDIP and PLCC packages.

Transition sockets, used along with a device adapter,

provide a method of accommodating all PIC MCU

packages, including SOIC, SSOP, PQFP and TQFP

packages.

2.0 MPLAB ICE 2000 SYSTEM

A brief overview of the different components of the

system is shown in the figure below. Each component

is discussed in the following subsections.

FIGURE 2-1: MPLAB® ICE 2000

EMULATOR SYSTEM

2.1 Host to Pod Cable

This is a standard parallel interface cable. MPLAB ICE

2000 is tested with a 6-foot cable. A longer cable may

work, but is not ensured. The cable connects to a par-

allel port on the PC. If a PC has a printer connected to

an LPT device, it is recommended that an additional

interface card be installed, rather than using a splitter

or an A/B switch.

2.2 Emulator Pod

The Emulator Pod contains emulator memory and

control logic. MPLAB ICE 2000 contains a main board

and an additional board for expanded trace memory

and complex control logic. There are no field service-

able parts in the pod. For more information on the pod,

see the MPLAB ICE 2000 on-line help file in MPLAB

IDE (Help>Topics) or the “MPLAB® ICE 2000

In-Circuit Emulator User’s Guide” (DS51488).

The MPLAB ICE 2000 processor module is inserted

into the pod for operation.

2.3 Processor Module

The processor module contains the emulator chip, logic

and low-voltage circuitry. There are no field-serviceable

parts mounted on the printed circuit board housed

within the processor module enclosure.

Communications Cable

Power Supply

Cable

Emulator Pod

Processor Module

with Cable

Logic Probe

Connector

Device Adapter

Transition Socket

Processor Module and Device Adapter Specification

MPLAB® ICE 2000

2.4 Flex Circuit Cable

Once the processor module is inserted into the

emulator pod, the flex circuit cable extends the

emulator system to the target application. This is a

custom cable that is attached inside the processor

module enclosure, and can be replaced in the field by

removing the end cap of the processor module

enclosure.

Please, DO NOT PULL on the flex circuit cable to

remove the processor module from the pod. Use the

fins of the processor module end cap to leverage the

module from the pod.

Emulator analog functions may not operate within the

performance specifications published in the device

data sheet due to parasitic capacitance (up to 120 pf)

of the flex cable.

2.5 Device Adapter

The device adapter provides a common interface for

the device being emulated. It is provided in standard

DIP and PLCC styles. The adapter also contains a spe-

cial device that provides an oscillator clock to accu-

rately emulate the oscillator characteristics of the PIC

MCU.

Due to components on the device adapter, which

require target power, the device adapter should be

removed from the flex circuit cable (see Figure 2-1)

when emulator power is being used and the processor

module is not connected to the target. This will

eliminate any loading effects on I/O pins.

2.6 Transition Socket

Transition Sockets are available in various styles to

allow a common device adapter to be connected to one

of the supported surface mount package styles. Transi-

tion sockets are available for various pin counts and

pitches for SOIC, QFP and other styles. For more infor-

mation on transition sockets, see the “MPLAB® ICE

2000/4000 Transition Socket Specification” (DS51194).

An emulator system consists of the following

components which can be ordered separately:

• An emulator pod (including the host-to-pod cable

and power supply)

• A processor module (including the flex circuit

cable)

• A device adapter

• An optional transition socket (for surface mount

emulation)

3.0 EMULATOR-RELATED ISSUES

General limitations that apply to the MPLAB ICE 2000

emulator may be found in the on-line help. Select

Help>Topics and then select “MPLAB ICE 2000” under

“Debuggers”.

Device-specific limitations can be found as above or by

selecting Debugger>Settings, clicking the Limitations

tab, and then clicking the Details button.

4.0 PROCESSOR MODULES

Processor modules are identified on the top of the

assembly (e.g., PCM18XA0). To determine which

processors are supported by a specific module, refer to

the file “Readme for MPLAB ICE 2000.txt” in the

MPLAB IDE installation directory or the latest “Product

Selector Guide” (DS00148), which can be found on the

Microchip web site at www.microchip.com.

A typical processor module contains a special bond-out

version of a PIC MCU, with device buffers to control

data flow and control logic. It provides the means of

configuring the MPLAB ICE 2000 emulator for a

specific PIC MCU family and handles low-voltage emu-

lation when needed.

4.1 Power

The operating voltage for most of the control logic and

buffering on the processor module is +5V and is

supplied by the emulator pod. Power to the emulator

processor and some of its surrounding buffers is user-

selectable, and can be powered by the emulator pod

(at +5V only) or the target application system (from

2.0V to 5.5V). This is software selectable and is

configurable through the MPLAB IDE software. At no

time will the emulator system directly power the target

application system. ALWAYS insert the processor

module into the emulator pod before applying power to

the pod.

When connecting to a target application system, there

may be a voltage level on the target application even

though power has not yet been applied to the target

application circuit. This is normal, and is due to current

leakage through VCC of the device adapter. The current

leakage will typically be less than 20 mA. However, if

the target application is using a voltage regulator, it

should be noted that some regulators require the use of

an external shunt diode between VIN and VOUT for

reverse-bias protection. Refer to the manufacturer’s

data sheets for additional information.

Note: When removing the processor module, DO

NOT PULL on the flex cable. Use the tabs

on the processor module or damage to the

flex cable may occur.

4.1.1 EMULATOR PROCESSOR POWER

SUPPLIED BY EMULATOR SYSTEM

If the emulator system is selected to power the emula-

tor processor in the processor module, the emulator

system can be operated without being connected to a

target application. If the system is being connected to a

target application, the power to the pod should be

applied before applying power to the target application.

The target application system’s VCC will experience a

small current load (10 mA typical) when the emulator

system is connected via a device adapter. This is

because the target system must always power the

clock chip in the processor module.

4.1.2 EMULATOR PROCESSOR POWER

SUPPLIED BY TARGET APPLICATION

SYSTEM

When the MPLAB IDE software is brought up, the

emulator system is first initialized with the emulator

system powering the emulator processor. The

“Processor Power Supplied by Target Board” option

may then be selected using the Power tab of the

Settings dialog (Debugger>Settings) to power the

processor module from the target board.

When operating from external power, the processor

module will typically represent a current load equivalent

to the device being emulated (according to its data

sheet) plus approximately 100 mA. Keep in mind that

the target application will affect the overall current load

of the processor module, dependent upon the load

placed upon the processor I/O.

When the processor power is supplied by the target

application system, an external clock (from the target

board) may also be provided. MPLAB IDE will not allow

use of an external clock without the use of external

power.

4.1.3 OPERATING VOLTAGE OF 4.6 TO 5.5

VOLTS

If the target application system’s operating voltage is

between 4.55V (±120 mV) and 5.5V, the processor

module will consider this a STANDARD VOLTAGE

condition. In this mode, the processor can run to its

highest rated speed (as indicated in its data sheet).

The recommended power-up sequence is:

1. Apply power to the PC host.

2. Apply power to the emulator pod and processor

module assembly.

3. Invoke MPLAB IDE.

4. Select Debugger > Settings and click the Power

tab. Configure system for “Processor Power

Supplied by Target Board”.

5. At the error message, apply power to the target

application circuit. Then acknowledge the error.

6. Issue a System Reset (from the debugger

menu) before proceeding.

4.1.4 OPERATING VOLTAGE OF 2.0 TO 4.6

VOLTS

If the target application system’s operating voltage is

between 2.0V and 4.55V (±120 mV), the processor

module will consider this a LOW VOLTAGE condition.

In this mode, the processor is limited to its rated speed

at a given voltage level (as indicated in its data sheet).

To minimize the amount of reverse current that the

target system is exposed to, the recommended

power-up sequence is:

1. Apply power to the PC host.

2. Apply power to the emulator pod and processor

module assembly.

3. Invoke MPLAB IDE.

4. Select Debugger > Settings and click the Power

tab. Configure system for “Processor Power

Supplied by Target Board”.

5. At the error message, apply power to the target

application circuit. Then acknowledge the error.

6. Issue a System Reset (from the debugger

menu) before proceeding.

7. Select Debugger > Settings and click the Power

tab. Verify that the dialog says “Low Voltage

Enabled.” Click Cancel to close the dialog.

4.2 Operating Frequency

The processor modules will support the maximum

frequency (except where noted in Section 3.0

“Emulator-Related Issues”) of the device under

emulation. The maximum frequency of a PIC MCU

device is significantly lower when the operating volt-

age is less than 4.5V.

The processor modules will support a minimum

frequency of 32 kHz. When operating at low

frequencies, response to the screen may be slow.

4.3 Clock Options

MPLAB ICE 2000 allows internal and external clocking.

When set to internal, the clock is supplied from the

internal programmable clock, located in the emulator

pod. When set to external, the oscillator on the target

application system will be utilized.

4.3.1 CLOCK SOURCE FROM EMULATOR

Refer to the MPLAB ICE 2000 on-line help file in

MPLAB IDE (Help>Topics) or the “MPLAB® ICE 2000

In-Circuit Emulator User’s Guide” (DS51488), “Using

the On-Board Clock”, for configuring MPLAB IDE to

supply the clock source.

Product specificaties

Merk:	Microchip
Categorie:	Niet gecategoriseerd
Model:	PIC16F737

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