Microchip MIC2127A Handleiding

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 2016-2020 Microchip Technology Inc. DS20005676F-page 1

MIC2127A

Features

• Hyper Speed Control® Architecture Enables:

- High input to output voltage conversion ratio

capability

- Any Capacitor™ stable

- Ultra-fast load transient response

• Wide 4.5V-75V Input Voltage Range

• Adjustable Output Voltage from 0.6V to 30V

• 270 kHz-800 kHz Programmable Switching

Frequency

• Built-In 5V Regulator for Single-Supply Operation

• Auxiliary Bootstrap LDO for Improving System

Efficiency

• Internal Bootstrap Diode

• Selectable Light Load Operating Mode

• Enable Input and Power Good Output

• Programmable Current Limit

• Hiccup Mode Short-Circuit Protection

• Soft Start, Internal Compensation and Thermal

Shutdown

• Supports Safe Start-Up into a Prebiased Output

• AEC-Q100 Qualified (VAO suffix)

Applications

• Networking/Telecom Equipment

• Base Station, Servers

• Distributed Power Systems

• Industrial Power Supplies

• Automotive Power Supplies

General Description

The MIC2127A device is a constant-frequency

synchronous buck controller featuring a unique

adaptive on-time control architecture. The MIC2127A

device operates over an input voltage range from

4.5V-75V. The output voltage is adjustable down to

0.6V with an accuracy of ±1%. The device operates

with programmable switching frequency from 270 kHz

to 800 kHz.

The MIC2127A device features a MODE pin that allows

the user to select either Continuous Conduction mode

or HyperLight Load® (HLL) mode under light loads. An

auxiliary bootstrap LDO improves the system efficiency

by supplying the MIC2127A internal circuit bias power

and gate drivers from the output of the converter. A

logic level enable (EN) signal can be used to enable or

disable the controller. MIC2127A can start-up

monotonically into a prebiased output. The MIC2127A

device features an open drain power good signal (PG)

that signals when the output is in regulation and can be

used for simple power supply sequencing.

MIC2127A offers a full suite of protection features to

ensure protection of the IC during Fault conditions.

These include undervoltage lockout to ensure proper

operation under power-sag conditions, “hiccup” mode

short-circuit protection, internal soft start of 5 ms to

reduce inrush current during start-up and thermal shut-

down.

The MIC2127A device is available in a 16-pin

3 mm × 3 mm VQFN package, with an operating

junction temperature range from –40°C to +125°C.

Typical Application Circuit

PVDD

VDD

MODE

FREQ EXTVDD

ILIM

BST

VIN VIN

4.5V*

to 75V

VOUT

5V@5A

VOUT

VIN

4.7 μF

2.2 μFX3

47 μF

10 μH

0.1 μF

4.7 nF

1 μF

4.7 μF

10

36 k

7.5 k

1 k

100 k

60 k

1.3 k

VIN

MIC2127A

PGND

AGND

330 μF

0.1 μF

Q1,Q3: SiR878ADP

L1: SRP1265A-100M, Bourns

C1: 10SVP330M

*Output voltage follows input voltage when the input is below the target output voltage

VDD

75V, Synchronous Buck Controller Featuring Adaptive

On-Time Control

 2016-2020 Microchip Technology Inc. DS20005676F-page 2

MIC2127A

Package Type

Functional Block Diagram

BST

PG MODE

FREQ

PGND

PVDD

EXTVDD

VIN

VDD

AGND

ILIM

15 14 13

5 6 7 8

MIC2127A

3 x 3 VQFN*

(Top View)

* Includes Exposed Thermal Pad (EP); see Table 3-1.

VDD

BST

VDD

FREQ

PVDD VIN

PGND

ILIM

Zero Crossing

Detection (ZCD) and

Negative Current Limit

THERMAL

SHUTDOWN

11 TON

ESTIMATION

Control

Logic

GND

EXTVDD

LINEAR

REGULATOR

COMPENSATION

VREF

5DH

7DL

CURRENT

LIMIT

DETECTION

0.9

100 μA

LINEAR

REGULATOR

0.6V

VREF

MODE

Soft

Start

UVLO

 2016-2020 Microchip Technology Inc. DS20005676F-page 3

MIC2127A

1.0 ELECTRICAL CHARACTERISTICS

Absolute Maximum Ratings †

VIN, FREQ, ILIM, SW to PGND .................................................................................................................... –0.3V to +76V

VSW to PGND (Transient < 50 ns) ............................................................................................................................... –5V

VDD, PVDD, FB, PG, MODE to A

GND ........................................................................................................... –0.3V to +6V

EXTVDD to AGND ...................................................................................................................................... –0.3V to +16V

BST to SW .................................................................................................................................................. –0.3V to +6V

BST to AGND ............................................................................................................................................. –0.3V to +82V

EN to AGND ...................................................................................................................................... –0.3V to (V

IN +0.3V)

DH, DL to AGND.............................................................................................................................. –0.3V to (V

DD +0.3V)

PGND to AGND........................................................................................................................................... –0.3V to +0.3V

Junction Temperature........................................................................................................................................... +150°C

Storage Temperature (TS)..................................................................................................................... –65°C to +150°C

Lead Temperature (soldering, 10s) ........................................................................................................................ 260°C

ESD Rating( )1......................................................................................................................................................... 1000V

Note 1: Devices are ESD sensitive. Handling precautions recommended. Human body model, 1.5 k in series with

100 pF.

Operating Ratings( )1

Supply Voltage (VIN) ..................................................................................................................................... 4.5V to 75V

SW, FREQ, ILIM, EN........................................................................................................................................... 0V to V

EXTVDD ....................................................................................................................................................... 0V to 13.2V

Junction Temperature (TJ)..................................................................................................................... –40°C to +125°C

Package Thermal Resistance (3 mm × 3 mm VQFN 16LD)

Junction-to-Ambient (JA) ................................................................................................................................. 50.8°C/W

Junction-to-Case (JC

) ...................................................................................................................................... 25.3°C/W

Note 1: The device is not ensured to function outside the operating range.