Microchip HV56020 Handleiding

Microchip Niet gecategoriseerd HV56020

Lees hieronder de 📖 handleiding in het Nederlandse voor Microchip HV56020 (51 pagina's) in de categorie Niet gecategoriseerd. Deze handleiding was nuttig voor 44 personen en werd door 2 gebruikers gemiddeld met 4.5 sterren beoordeeld

Download PDF
Pagina 1/51
2020-2022 Microchip Technology Inc. and its subsidiaries DS20006328B
HV56020/22
Evaluation Board
User’s Guide
DS20006328B-page 2
2020-2022 Microchip Technology Inc. and its subsidiaries
This publication and the information herein may be used only
with Microchip products, including to design, test, and integrate
Microchip products with your application. Use of this informa-
tion in any other manner violates these terms. Information
regarding device applications is provided only for your conve-
nience and may be superseded by updates. It is your responsi-
bility to ensure that your application meets with your
specifications. Contact your local Microchip sales office for
additional support or, obtain additional support at https://
www.microchip.com/en-us/support/design-help/client-support-
services.
THIS INFORMATION IS PROVIDED BY MICROCHIP "AS IS".
MICROCHIP MAKES NO REPRESENTATIONS OR WAR-
RANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED,
WRITTEN OR ORAL, STATUTORY OR OTHERWISE,
RELATED TO THE INFORMATION INCLUDING BUT NOT
LIMITED TO ANY IMPLIED WARRANTIES OF NON-
INFRINGEMENT, MERCHANTABILITY, AND FITNESS FOR A
PARTICULAR PURPOSE, OR WARRANTIES RELATED TO
ITS CONDITION, QUALITY, OR PERFORMANCE.
IN NO EVENT WILL MICROCHIP BE LIABLE FOR ANY INDI-
RECT, SPECIAL, PUNITIVE, INCIDENTAL, OR CONSE-
QUENTIAL LOSS, DAMAGE, COST, OR EXPENSE OF ANY
KIND WHATSOEVER RELATED TO THE INFORMATION OR
ITS USE, HOWEVER CAUSED, EVEN IF MICROCHIP HAS
BEEN ADVISED OF THE POSSIBILITY OR THE DAMAGES
ARE FORESEEABLE. TO THE FULLEST EXTENT
ALLOWED BY LAW, MICROCHIP'S TOTAL LIABILITY ON
ALL CLAIMS IN ANY WAY RELATED TO THE INFORMATION
OR ITS USE WILL NOT EXCEED THE AMOUNT OF FEES, IF
ANY, THAT YOU HAVE PAID DIRECTLY TO MICROCHIP
FOR THE INFORMATION.
Use of Microchip devices in life support and/or safety applica-
tions is entirely at the buyer's risk, and the buyer agrees to
defend, indemnify and hold harmless Microchip from any and
all damages, claims, suits, or expenses resulting from such
use. No licenses are conveyed, implicitly or otherwise, under
any Microchip intellectual property rights unless otherwise
stated.
Note the following details of the code protection feature on Microchip products:
• Microchip products meet the specifications contained in their particular Microchip Data Sheet.
• Microchip believes that its family of products is secure when used in the intended manner, within operating specifications, and
under normal conditions.
• Microchip values and aggressively protects its intellectual property rights. Attempts to breach the code protection features of
Microchip product is strictly prohibited and may violate the Digital Millennium Copyright Act.
• Neither Microchip nor any other semiconductor manufacturer can guarantee the security of its code. Code protection does not
mean that we are guaranteeing the product is "unbreakable" Code protection is constantly evolving. Microchip is committed to
continuously improving the code protection features of our products.
Trademarks
The Microchip name and logo, the Microchip logo, Adaptec, AVR,
AVR logo, AVR Freaks, BesTime, BitCloud, CryptoMemory,
CryptoRF, dsPIC, flexPWR, HELDO, IGLOO, JukeBlox, KeeLoq,
Kleer, LANCheck, LinkMD, maXStylus, maXTouch, MediaLB,
megaAVR, Microsemi, Microsemi logo, MOST, MOST logo,
MPLAB, OptoLyzer, PIC, picoPower, PICSTART, PIC32 logo,
PolarFire, Prochip Designer, QTouch, SAM-BA, SenGenuity,
SpyNIC, SST, SST Logo, SuperFlash, Symmetricom, SyncServer,
Tachyon, TimeSource, tinyAVR, UNI/O, Vectron, and XMEGA are
registered trademarks of Microchip Technology Incorporated in the
U.S.A. and other countries.
AgileSwitch, APT, ClockWorks, The Embedded Control Solutions
Company, EtherSynch, Flashtec, Hyper Speed Control, HyperLight
Load, Libero, motorBench, mTouch, Powermite 3, Precision Edge,
ProASIC, ProASIC Plus, ProASIC Plus logo, Quiet- Wire,
SmartFusion, SyncWorld, Temux, TimeCesium, TimeHub,
TimePictra, TimeProvider, TrueTime, and ZL are registered
trademarks of Microchip Technology Incorporated in the U.S.A.
Adjacent Key Suppression, AKS, Analog-for-the-Digital Age, Any
Capacitor, AnyIn, AnyOut, Augmented Switching, BlueSky,
BodyCom, Clockstudio, CodeGuard, CryptoAuthentication,
CryptoAutomotive, CryptoCompanion, CryptoController,
dsPICDEM, dsPICDEM.net, Dynamic Average Matching, DAM,
ECAN, Espresso T1S, EtherGREEN, GridTime, IdealBridge, In-
Circuit Serial Programming, ICSP, INICnet, Intelligent Paralleling,
IntelliMOS, Inter-Chip Connectivity, JitterBlocker, Knob-on-Display,
KoD, maxCrypto, maxView, memBrain, Mindi, MiWi, MPASM, MPF,
MPLAB Certified logo, MPLIB, MPLINK, MultiTRAK, NetDetach,
Omniscient Code Generation, PICDEM, PICDEM.net, PICkit,
PICtail, PowerSmart, PureSilicon, QMatrix, REAL ICE, Ripple
Blocker, RTAX, RTG4, SAM-ICE, Serial Quad I/O, simpleMAP,
SimpliPHY, SmartBuffer, SmartHLS, SMART-I.S., storClad, SQI,
SuperSwitcher, SuperSwitcher II, Switchtec, SynchroPHY, Total
Endurance, Trusted Time, TSHARC, USBCheck, VariSense,
VectorBlox, VeriPHY, ViewSpan, WiperLock, XpressConnect, and
ZENA are trademarks of Microchip Technology Incorporated in the
U.S.A. and other countries.
SQTP is a service mark of Microchip Technology Incorporated in
the U.S.A.
The Adaptec logo, Frequency on Demand, Silicon Storage
Technology, and Symmcom are registered trademarks of Microchip
Technology Inc. in other countries.
GestIC is a registered trademark of Microchip Technology Germany
II GmbH & Co. KG, a subsidiary of Microchip Technology Inc., in
other countries.
All other trademarks mentioned herein are property of their
respective companies.
© 2020-2022, Microchip Technology Incorporated and its
subsidiaries.
All Rights Reserved.
ISBN: 978-1-6683-1770-9
For information regarding Microchip’s Quality Management Systems,
please visit www.microchip.com/quality.
HV56020/22
EVALUATION BOARD
USER’S GUIDE
2020-2022 Microchip Technology Inc. and its subsidiaries DS20006328B-page 3
Table of Contents
Preface ........................................................................................................................... 5
Introduction............................................................................................................ 5
Document Layout .................................................................................................. 5
Conventions Used in this Guide ............................................................................ 6
Recommended Reading........................................................................................ 7
The Microchip Website.......................................................................................... 7
Customer Support ................................................................................................. 7
Document Revision History ................................................................................... 7
Chapter 1. Product Overview
1.1 Introduction ..................................................................................................... 9
1.2 HV56020/22 Device Overview ....................................................................... 9
1.3 HV56020/22 Device Features ........................................................................ 9
1.4 HV56020/22 Evaluation Board Overview ....................................................... 9
1.5 Contents of the HV56020/22 Evaluation Board ............................................ 11
Chapter 2. Installation and Operation
2.1 Getting Started ............................................................................................. 13
2.2 Setup Procedure .......................................................................................... 13
2.3 Windows® PC Operation ............................................................................. 18
2.4 Android™ Phone Operation ......................................................................... 26
2.5 Capacitive Touch Operation ......................................................................... 29
Appendix A. Schematic and Layouts
A.1 Introduction .................................................................................................. 31
A.2 Board – Schematic Top Level ...................................................................... 32
A.3 Board – Schematic Connectors ................................................................... 33
A.4 Board – Schematic MCU ............................................................................. 34
A.5 Board – Schematic HV Drivers .................................................................... 35
A.6 Board – Schematic BLE ............................................................................... 36
A.7 Board – Top Layer and Silk ........................................................................ 37
A.8 Board – Mid-Layer 1 .................................................................................... 37
A.9 Board – Ground Plane ................................................................................. 38
A.10 Board – Power Plane ................................................................................. 38
A.11 Board – Mid-Layer 2 .................................................................................. 39
A.12 Board – Bottom Layer and Silk .................................................................. 39
Appendix B. Bill of Materials (BOM)........................................................................... 41
Appendix C. Waveforms
C.1 Introduction .................................................................................................. 45
Worldwide Sales and Service .................................................................................... 51
HV56020/22 Evaluation Board User’s Guide
DS20006328B-page 4
2020-2022 Microchip Technology Inc. and its subsidiaries
NOTES:
HV56020/22
EVALUATION BOARD
USER’S GUIDE
2020-2022 Microchip Technology Inc. and its subsidiaries DS20006328B-page 5
Preface
INTRODUCTION
This chapter contains general information that will be useful to know before using the
HV56020/22 Evaluation Board. Items discussed in this chapter include:
•Document Layout
•Conventions Used in this Guide
•Recommended Reading
•The Microchip Website
•Customer Support
•Document Revision History
DOCUMENT LAYOUT
This document describes how to use the HV56020/22 Evaluation Board as a develop-
ment tool to emulate and debug firmware on a target board.
The manual layout is as follows:
•Chapter 1. “Product Overview” – Important information about the HV56020/22
Evaluation Board.
•Chapter 2. “Installation and Operation” – Includes a detailed description of
each function of the evaluation board and instructions on how to use the board.
•Appendix A. “Schematic and Layouts” – Shows the schematic and layout
diagrams for the HV56020/22 Evaluation Board.
•Appendix B. “Bill of Materials (BOM)” – Lists the parts used to build the
HV56020/22 Evaluation Board.
•Appendix C. “Waveforms” – Describes the waveforms for the HV56020/22
Evaluation Board.
NOTICE TO CUSTOMERS
All documentation becomes dated, and this manual is no exception. Microchip tools and
documentation are constantly evolving to meet customer needs. Some actual dialog and/or
tool descriptions may differ from those in this document. Please refer to our website
(www.microchip.com) to obtain the latest documentation available.
Documents are identified with a “DS” number. This number is located on the bottom of each
page and in front of the page number. The numbering convention for the DS number is
“DSXXXXXXXXA”, where “XXXXXXXX” is the document number and “A” is the revision level
of the document.
For the most up-to-date information on development tools, see the MPLAB® IDE online help.
Select the Help menu and then Topics to open a list of available online help files.
HV56020/22 Evaluation Board User’s Guide
DS20006328B-page 6
2020-2022 Microchip Technology Inc. and its subsidiaries
CONVENTIONS USED IN THIS GUIDE
This manual uses the following documentation conventions:
DOCUMENTATION CONVENTIONS
Description Represents Examples
Arial font:
Italic characters Referenced books MPLAB® IDE User’s Guide
Emphasized text ...is the only compiler...
Initial caps A window the Output window
A dialog the Settings dialog
A menu selection select Enable Programmer
Quotes A field name in a window or
dialog
“Save project before build”
Underlined, italic text with
right angle bracket
A menu path File>Save
Bold characters A dialog button Click OK
A tab Click the Power tab
N‘Rnnnn A number in verilog format,
where N is the total number of
digits, R is the radix and n is a
digit.
4‘b0010, 2‘hF1
Text in angle brackets < > A key on the keyboard Press <Enter>, <F1>
Courier New font:
Plain Courier New Sample source code #define START
Filenames autoexec.bat
File paths c:\mcc18\h
Keywords _asm, _endasm, static
Command-line options -Opa+, -Opa-
Bit values 0, 1
Constants 0xFF, ‘A’
Italic Courier New A variable argument file.o, where file can be
any valid filename
Square brackets [ ] Optional arguments mcc18 [options] file
[options]
Curly brackets and pipe
character: { | }
Choice of mutually exclusive
arguments; an OR selection
errorlevel {0|1}
Ellipses... Replaces repeated text var_name [,
var_name...]
Represents code supplied by
user
void main (void)
{ ...
}
Preface
2020-2022 Microchip Technology Inc. and its subsidiaries DS20006328B-page 7
RECOMMENDED READING
This user’s guide describes how to use the HV56020/22 Evaluation Board. Other useful
documents are listed below. The following Microchip documents are available and
recommended as supplemental reference resources:
•HV56020 Data Sheet – “Dual High-Voltage Operational Amplifier with Setup
Converter and Power MOSFET” (DS200006335).
•HV56022 Data Sheet – “Dual High-Voltage Operational Amplifier”
(DS50006326).
• “MPLAB® X IDE User’s Guide” (DS50006326).
THE MICROCHIP WEBSITE
Microchip provides online support via our website at www.microchip.com. This website
is used as a means to make files and information easily available to customers.
Accessible by using your favorite Internet browser, the website contains the following
information:
•Product Support – Data sheets and errata, application notes and sample
programs, design resources, user’s guides and hardware support documents,
latest software releases and archived software
•General Technical Support – Frequently Asked Questions (FAQs), technical
support requests, online discussion groups and Microchip consultant program
member listing
•Business of Microchip – Product selector and ordering guides, latest Microchip
press releases, listing of seminars and events, listing of Microchip sales offices,
distributors and factory representatives
CUSTOMER SUPPORT
Users of Microchip products can receive assistance through several channels:
• Distributor or Representative
• Local Sales Office
• Field Application Engineer (FAE)
• Technical Support
Customers should contact their distributor, representative or field application engineer
(FAE) for support. Local sales offices are also available to help customers. A listing of
sales offices and locations is included on the last page of this document.
Technical support is available through the website at:
http://www.microchip.com/support
DOCUMENT REVISION HISTORY
Revision B (December 2022)
• Updated Section 1.5 “Contents of the HV56020/22 Evaluation Board”.
• Updated Appendix A. “Schematic and Layouts”.
• Updated Appendix B. “Bill of Materials (BOM)”.
• Minor text and format changes throughout.
Revision A (November 2020)
• Initial release of this document.
HV56020/22 Evaluation Board User’s Guide
DS20006328B-page 8
2020-2022 Microchip Technology Inc. and its subsidiaries
NOTES:
HV56020/22
EVALUATION BOARD
USER’S GUIDE
2020-2022 Microchip Technology Inc. and its subsidiaries DS20006328B-page 9
Chapter 1. Product Overview
1.1 INTRODUCTION
This chapter provides an overview of the HV56020/22 Evaluation Board and covers the
following topics:
•HV56020/22 Device Overview
•HV56020/22 Device Features
•HV56020/22 Evaluation Board Overview
•Contents of the HV56020/22 Evaluation Board
1.2 HV56020/22 DEVICE OVERVIEW
The HV56020 is a multi-chip module (MCM) consisting of three devices: dual high-
voltage operational amplifiers, DC-to-DC converter controller and power MOSFET. The
operational amplifiers are designed to drive haptic (piezo) actuators at 225V, with a
40 mA minimum peak source/sink current. The DC-to-DC controller and the power
MOSFET, along with an external transformer, generate the required voltage supply for
the high-voltage operational amplifiers using a non-isolated flyback configuration.
In addition, the HV56020 includes protection circuitry to provide a reliable solution,
such as: over/undervoltage protection, short-circuit protection (DC-to-DC), tempera-
ture sensor and output voltage comparators for short-circuit detection on the
high-voltage operational amplifiers outputs.
The HV56022 consists of dual high-voltage operational amplifiers with a 40 mA mini-
mum peak current and a 225V maximum voltage drive. The device is designed to be
used along with the HV56020 or stand alone to increase the channel count.
1.3 HV56020/22 DEVICE FEATURES
• Windows® 10 PC GUI
• Android™ BLE Application
• Connector for Three Capacitive Touch Buttons
• Single Li-Ion Battery Operation
• Battery Charging Circuit
• Four High-Voltage Operational Amplifiers
• 4 Mbit SPI Serial Flash Memory
• 225V Maximum Voltage Operation
1.4 HV56020/22 EVALUATION BOARD OVERVIEW
The HV56020/22 Evaluation Board represents a 4-channel haptic driver solution. The
Evaluation Board contains: HV56020 (1), HV56022 (1), 32-bit MCU (1), 12-bit dual
DACs (2), low quiescent current LDO (1), Bluetooth® BLE module (1), LDO Ripple
Blocker (1), and Battery Charger Controller Management IC (1).
HV56020/22 Evaluation Board User’s Guide
DS20006328B-page 10
2020-2022 Microchip Technology Inc. and its subsidiaries
1.4.1 Evaluation Board Block Diagram
FIGURE 1-1: HV56020/22 Evaluation Board Block Diagram.
Figure 1-1 presents the Microchip components used in the HV56020/22 Evaluation
Board:
USB
MCP1812
LDO
MCP73830
BAT. CHARGER
MIC94325
RIPPLE BLOCKER
RN4871
BLE
SAML21
MCU
SST25PF040C
FLASH MEM
MCP48FEB22
DUAL DACS
MCP48FEB22
DUAL DACS
ONOFF
HV56022
(2) HV OP-AMPS
5V
2.7-4.7V VPP
HV56020
DC/DC, POWER FET &
(2) HV OP-AMPS
BLE
VCC VLL
VPP
VCC VLL VPP
SPI
SPI
VIN
PTC
Li-ion
HV56020 Dual high-voltage operational amplifier with boost converter and
power MOSFET
HV56022 Dual high-voltage operational amplifier
SAML21J18B 32-bit microcontroller with an ARM Cortex-M0 CPU
MCP48FEB22 12-bit dual digital-to-analog converter with SPI interface
RN4871 Bluetooth Low Energy Module
MCP73830 Single-Cell Li-Ion charge management controller with soft start
SST25PF040C 4 Mbit 2.3-3.6V SPI serial flash
MCP1812 300 mA ultra-low IQ LDO linear regulator
MIC94325 500 mA low-frequency ripple attenuation LDO
Product Overview
2020-2022 Microchip Technology Inc. and its subsidiaries DS20006328B-page 11
1.5 CONTENTS OF THE HV56020/22 EVALUATION BOARD
The HV56020/22 Evaluation Board kit includes:
• HV56020/22 Evaluation Board (ADM00924)
• Important Information Sheet
FIGURE 1-2: HV56020/22 Evaluation Board.
FIGURE 1-3: HV56020/22 Evaluation Board Side View.
ON/OFF
Switch (S1) Micro-USB VIN
Output
Connector
HV56020/22 Evaluation Board User’s Guide
DS20006328B-page 12
2020-2022 Microchip Technology Inc. and its subsidiaries
NOTES:
HV56020/22
EVALUATION BOARD
USER’S GUIDE
2020-2022 Microchip Technology Inc. and its subsidiaries DS20006328B-page 13
Chapter 2. Installation and Operation
2.1 GETTING STARTED
The HV56020/22 Evaluation Board is fully assembled and tested. The board requires
an external voltage source.
2.1.1 Tools Required for Operation
• A single-cell Li-Ion battery (500 mAh or greater, battery male connector must be
compatible with P/N: S2B-PH-K-S(LF)(SN) or 440055-2)
• A personal computer with Windows® 10 or a phone/tablet with an Android™
system supporting BLE
• An oscilloscope to observe the waveforms and measure electrical parameters
• Haptic loads or equivalent capacitance loads: 0.22 µF
• Refer to the product’s website for recommended actuators
2.2 SETUP PROCEDURE
To operate the HV56020/22 Evaluation Board, follow the steps below. Before using the
Evaluation Board, complete the Windows® 10 initial driver installation.
2.2.1 Windows® 10 Setup
1. Open the setup.exe application for the Windows® GUI setup.
FIGURE 2-1: MCHP Bridge Setup.
WARNING
Read the HV56020/22 Evaluation Board User’s Guide (this document) fully before
proceeding to board setup and usage.
Note: This is a one-time setup for the Windows® 10 PC.
HV56020/22 Evaluation Board User’s Guide
DS20006328B-page 14
2020-2022 Microchip Technology Inc. and its subsidiaries
2. Click Next in all the installation prompt windows.
3. Close the Installation Complete window, the MCHP Bridge logo should be visible
in the Start menu.
FIGURE 2-2: MCHP Bridge Installation.
2.2.1.1 WINDOWS® 10 INITIAL DRIVER INSTALLATION
1. Connect a single-cell Li-Ion battery to the J1 connector.
2. Connect the HV56020/22 Evaluation Board’s Micro-USB port to the PC's USB
port using a Micro-USB to USB Type A cable.
3. Launch the MCHP Haptic Bridge GUI. Turn on the HV56020/22 Evaluation Board
using switch S1 (see Figure 1-2).
FIGURE 2-3: MCHP Bridge.
4. The following windows will appear, click OK and reboot the board.
FIGURE 2-4: MCHP Bridge Start-Up and Reboot.
Installation and Operation
2020-2022 Microchip Technology Inc. and its subsidiaries DS20006328B-page 15
5. The MCHP Haptic Bridge GUI is active and recognizes the connected board as
shown below:
FIGURE 2-5: HV56020/22 Evaluation Board Connection.
2.2.2 Android™ Setup
1. Download the MCHP Haptic BLE App for Android™ from the product’s website.
2. Install the application on an Android™ phone/tablet supporting BLE.
3. Connect a Li-Ion battery to the J1 connector and turn on the board.
4. Launch the MCHP Haptic BLE App as shown below:
FIGURE 2-6: MCHP Haptic Application.
HV56020/22 Evaluation Board User’s Guide
DS20006328B-page 16
2020-2022 Microchip Technology Inc. and its subsidiaries
5. Select the Pair and Connect option.
FIGURE 2-7: Pair and Connect.
6. Enter “123456” as PIN code.
FIGURE 2-8: Connecting the Device.
Installation and Operation
2020-2022 Microchip Technology Inc. and its subsidiaries DS20006328B-page 17
7. Once paired successfully, the MCHP Haptic BLE App becomes active.
FIGURE 2-9: Application Activated.
HV56020/22 Evaluation Board User’s Guide
DS20006328B-page 18
2020-2022 Microchip Technology Inc. and its subsidiaries
2.3 WINDOWS® PC OPERATION
2.3.1 Introduction
The MCHP Haptic Bridge GUI operates with two different data file formats:
CSV (Comma Separated Value) and WAV (Waveform Audio File).
2.3.1.1 CSV FILE FORMAT
The CSV file format consists of two components: time and voltage. The time scale is
defined by the data sampling rate, where a column with 8000 data points corresponds
to a single waveform with 8 kS/s. Vertical columns correspond to the sampling data
points of the waveforms. The total number of cells divided by one second sets the
sampling rate of the waveforms. All waveforms (columns) must have the same
sampling rate (length) to avoid a program malfunction. The supported sampling fre-
quency range of the MCHP Haptic Bridge GUI is 8 kS/s to 20 kS/s.
The default sampling frequency of the MCHP Haptic Bridge GUI is 8 kS/s. If a file con-
tains 16 kS/s, it will be interpreted as a waveform with 8 kS/s, with a 2s duration. The
sampling rate can be adjusted for any CSV file by selecting a different sampling rate
option available in the GUI. See Section 2.3.2 “Operation - Simple Mode” for more
details.
Waveform voltage amplitude is defined by an 8-bit code word format, where 0
corresponds to 0% and 255 to 100% of the VPP voltage selected. There are 8 voltage
levels available in the MCHP Haptic Bridge: 225V, 202.5V, 180V, 157.5V, 135V, 112.5V,
90V, and 67.5V. Figure 2-10 shows a CSV sample file of four channels, with an 8 kS/s
format.
FIGURE 2-10: CSV File Sample with 4-8 kS/s Waveforms.
Column A corresponds to waveform 1 and it is transmitted by default to HVOUT1.
Column B is transmitted to HVOUT2, column C to HVOUT3 and column D to HVOUT4.
The GUI allows a remapping of the waveforms to any HVOUT channels. See
Section 2.3.2 “Operation - Simple Mode”.
8000 1031
A B C D E
1
2
3
4
5
6
204 78 1411
204 76 1412
204 75 1425
142 76 10 142
144 81 18 144
144 90 50 144
7998 4 410 55
7999 2542
Waveform: 1 2 3 4
Waveform Voltage Amplitude
204/255 = 80% = 180V (VPP = 225V)
Sampling Frequency
8000/1s
Installation and Operation
2020-2022 Microchip Technology Inc. and its subsidiaries DS20006328B-page 19
2.3.1.2 WAV FILE FORMAT
WAV files are used and generated by an audio processing software and most of the
time consist of two channels. For the MCHP Haptic Bridge GUI, WAV files must contain
four audio channels with the allowable sampling frequency range of 8 kS/s to 20 kS/s.
Sampling frequency is determined and adjusted by the audio processing software.
WAV files with sampling frequencies out of the allowable range will cause the GUI to
malfunction.
The amplitude defined in a WAV file ranges from -1 to 1 in dB scale. That corresponds
to 0-255 when compared to the CSV file data format. Figure 2-11 shows a diagram of
a WAV file with four audio channels. Waveforms represented in full audio scale of -1 dB
to 1 dB correspond to a 100% voltage amplitude when transmitted to the HVOUTs
channels.
FIGURE 2-11: 4-Channel WAV File Format Diagram.
HV56020/22 Evaluation Board User’s Guide
DS20006328B-page 20
2020-2022 Microchip Technology Inc. and its subsidiaries
2.3.2 Operation - Simple Mode
The setup procedure must be successfully completed.
1. Connect a Li-Ion battery to the J1 connector.
2. Connect the HV56020/22 Evaluation Board’s Micro-USB cable to the PC USB
connector.
3. Launch the MCHP Haptic Bridge GUI.
FIGURE 2-12: MCHP Bridge.
4. Turn on the HV56020/22 Evaluation Board (S1).
5. The evaluation board will be recognized by the GUI as shown in Figure 2-13.
6. Select a channel, Actuator, to transmit.
7. Select a Waveform and press START.
- OK box will turn green for a successful transmission.
- If FAIL box lights up, select the Complete Mode and see the flags that cause
the error.
Note: For Cap touch operation, refer to Section 2.5 “Capacitive Touch
Operation”. For waveform types, see Appendix C.
FIGURE 2-13: The GUI Recognizes the Evaluation Board.
WARNING
Do not use the PC Windows® GUI along with the Android™ phone BLE application.
Installation and Operation
2020-2022 Microchip Technology Inc. and its subsidiaries DS20006328B-page 21
2.3.3 Operation - Complete Mode
1. Click in the Complete mode tab.
2.3.3.1 WAVEFORM SELECTION
1. Click the Add button to include the WAV or CSV file.
- WAV files automatically display the sampling rate.
- The CSV files sampling rate is set to 8000 Hz by default. The sampling rate
can be adjusted if desired. The maximum rate is 20 kS/s.
2. For continuous transmission of waveforms (optional), activate the Replay Effects
check box.
FIGURE 2-14: Waveform Selection.
Note: Power dissipation must be taken into account when the Replay Effects
option is used.
HV56020/22 Evaluation Board User’s Guide
DS20006328B-page 22
2020-2022 Microchip Technology Inc. and its subsidiaries
2.3.3.2 CHANNEL MAPPING
The channel mapping option allows the user to redirect waveforms to the desired
HVOUTs.
FIGURE 2-15: Channel Mapping.
2.3.3.3 EFFECTS
There are two available effects, Clipping and Ramp. Effects apply to all waveforms
(from 1 to 4) in the WAV or CSV files.
• The Ramp effect is in terms of milliseconds (ms). The effect is applied by default
to all waveforms with a 0 ms start time.
• Clipping is enabled when the check box is activated. Clipping limits can be
modified accordingly.
FIGURE 2-16: Clipping and Ramp Effects.
HV56020
HV56022
CSV/WAVE
File
1
2
3
4
2
3
4
1
HV Outputs
HV56020
HV56022
CSV/WAVE
File
1
2
3
4
2
3
4
1
HV Outputs
RAMP
CLIPPING
ORIG INA L
ORIG INA L
Installation and Operation
2020-2022 Microchip Technology Inc. and its subsidiaries DS20006328B-page 23
2.3.3.4 TRANSMISSION
Once waveform files and effects are selected and specified in the “WAVEFORM
SELECTION”, “OUTPUT MAPPING” and “EFFECTS” sections, the user can proceed
to the “TRANSMISSION” section. There are two subsections: “DC-to-DC Converter”
and “HV Amp Outputs”.
DC-to-DC Converter
1. Select the desired VPP Level.
FIGURE 2-17: DC-to-DC Converter VPP Selection.
TABLE 2-1: VPP LEVEL
Level (%) VPP (V)
100 225
90 202.5
80 180
70 157.5
60 135
50 112.5
40 90
30 67.5
HV56020/22 Evaluation Board User’s Guide
DS20006328B-page 24
2020-2022 Microchip Technology Inc. and its subsidiaries
READY, TEMP, SHORT, OVER VOLTAGE, VIN/CP FAILURE are status flags for the
converter. They are displayed by the GUI to indicate the current status of the power
supply.
•READY indicates that the VPP voltage has reached the set value and the GUI will
send data waveforms to the high-voltage amplifiers.
•TEMP indicates that the HV56020 IC has reached its maximum recommended
operating temperature of +125°C to +150°C. A TEMP flag will cause the GUI to
deactivate VPP and stop sending data to the high-voltage amplifiers to avoid
damage. When TEMP flag occurs, the GUI will block the START button for one
minute to let the board cool off and avoid sending data.
•SHORT indicates there is a short-circuit condition in the DC-to-DC Converter
VPP. A SHORT flag will cause the GUI to stop any operation.
•OVER VOLTAGE indicates that VPP is higher than its maximum recommended
operating voltage of 225V. The flag will cause the GUI to stop any operation.
•VIN/CP FAILURE indicates two possible scenarios: VIN or Charge Pump failures,
when VIN drops below the minimum operating voltage of 2.7V. A battery dis-
charged below 2.7V will cause the failure. If the internal Charge Pump of the
HV56020 drops below the minimum operating voltage, it will cause the device to
malfunction.
HV Amp Outputs
2. Select the HVOUT to transmit to. Only two channels allow a simultaneous
transmission.
COMP1 to COMP4 are the comparator output flags that monitor short circuits on the
HVOUTs. They are indicator flags. In case of a short circuit, they will turn red momen-
tarily. A short-circuit condition in the outputs disables the data transmission and
deactivates the power supply, VPP.
FIGURE 2-18: HV Amp Outputs Selection.
Installation and Operation
2020-2022 Microchip Technology Inc. and its subsidiaries DS20006328B-page 25
3. Click START to transmit data to the HV Amp Outputs. A successful transmission
only displays a READY flag.
FIGURE 2-19: Successful Transmission.
4. The GUI will stop sending data after the CSV/WAV file is transmitted (it depends
on the file’s size).
Note 1: If the Replay Effects option is selected, the GUI will play the file in an
infinite loop. Continuous transmission must be monitored carefully.
High-power dissipation might lead to thermal runaway and damage the
device components in the HV56020/22 Evaluation Board.
2: The Li-Ion battery will be charged by the MCP73830 when the MCU does
not send data and when the USB cable is connected to the evaluation
board. During charging, the CHG-LD1 will light.
HV56020/22 Evaluation Board User’s Guide
DS20006328B-page 26
2020-2022 Microchip Technology Inc. and its subsidiaries
2.4 ANDROID™ PHONE OPERATION
2.4.1 Introduction
The MCHP Haptic BLE App includes six waveform patterns stored in the evaluation
board’s memory.
2.4.2 Operation
1. Connect a Li-Ion battery to the J1 connector and turn on the board (S1).
2. Launch the MCHP Haptic BLE App.
3. The HV56020/22 Evaluation Board will be recognized and become active as
shown below:
FIGURE 2-20: MCHP Haptic BLE App.
Installation and Operation
2020-2022 Microchip Technology Inc. and its subsidiaries DS20006328B-page 27
4. Select the desired VPP level.
FIGURE 2-21: Selecting the VPP Level.
5. Select the HV CHANNELS for data transmission.
FIGURE 2-22: HV CHANNELS Selection.
HV56020/22 Evaluation Board User’s Guide
DS20006328B-page 28
2020-2022 Microchip Technology Inc. and its subsidiaries
6. Select a Waveform button for transmission. The READY flag will turn green
during transmission.
FIGURE 2-23: Waveform Transmission.
The Power Supply (DC-to-DC Converter) and Comparators flags have the same
functionality as described in Section 2.3.2 “Operation - Simple Mode”.
Installation and Operation
2020-2022 Microchip Technology Inc. and its subsidiaries DS20006328B-page 29
2.5 CAPACITIVE TOUCH OPERATION
2.5.1 Introduction
The SAML21J18 Microcontroller has the Peripheral Touch Controller, PTC, module that
allows for mutual and self-capacitance sensing modes. The HV56020 Evaluation
Board implements the self-capacitance mode using MCU pins: 5 (PB04), 6 (PB05), and
15 (PA06) for button touch implementation. The three touch sensor connections are
available at the J5 connector, see MCU schematic page. The J5 connector has
connections for an LED: anode and cathode. The anode is connected to 3.3V potential
and the cathode to a series resistor followed by n-channel transistor. A 20 mA (forward
current) LED is recommended to be used.
2.5.2 Operation
1. Connect the Li-ion battery to J1 connector
2. Connect the 6-position flat flex cable (e.g P/N: 0151670219) to J5 and to touch
sensor load with the 3 touch sensor buttons and LED
3. Turn-On the Evaluation Board (S1)
4. Press any of the three touch sensors: TS1, TS2 or TS3. Waveforms stored in
memory will be played
- TS1 transmits WAVE 1 into HVOUT1 (Appendix C: Figure C-5)
- TS2 transmits WAVE 2 into HVOUT2 (Appendix C: Figure C-6)
- TS3 transmits WAVE 3 into HVOUT3 (Appendix C: Figure C-7)
5. During transmission, the LED will light up when any of the three sensors is
touched
FIGURE 2-24: Capacitive Touch Operation.
HV56020/22 Evaluation Board User’s Guide
DS20006328B-page 30
2020-2022 Microchip Technology Inc. and its subsidiaries
NOTES:
HV56020/22
EVALUATION BOARD
USER’S GUIDE
2020-2022 Microchip Technology Inc. and its subsidiaries DS20006328B-page 31
Appendix A. Schematic and Layouts
A.1 INTRODUCTION
This appendix contains the following schematics and layouts for the
HV56020/22 Evaluation Board:
•Board – Schematic Top Level
•Board – Schematic Connectors
•Board – Schematic MCU
•Board – Schematic HV Drivers
•Board – Schematic BLE
•Board – Top Layer and Silk
•Board – Mid-Layer 1
•Board – Ground Plane
•Board – Power Plane
•Board – Mid-Layer 2
•Board – Bottom Layer and Silk
DS20006328B-page 32
2020-2022 Microchip Technology Inc. and its subsidiaries
A.2 BOARD – SCHEMATIC TOP LEVEL
USB
SWD
EN_BAT_CH
Connectors
HV56020_22_EVB_ConnectorsPower.SchDoc
USB
SWD
EN_CP
COMP1
COMP2
COMP3
COMP4
VREF_1&2
VREF_3&4
VREF SPI
DATA SPI
BLE
EN_BAT
MCU SAML21
HV56020_22_EVB_MCU.SchDoc
BLE
BLE BTLC1000
HV56020_22_EVB_BLE.SchDoc
EN_CP
VREF_1&2
VREF_3&4
COMP1
COMP2
COMP3
COMP4
VREF SPI
DATA SPI
HV56020 & HV56022
HV56020_22_EVB_HVD
2020-2022 Microchip Technology Inc. and its subsidiaries DS20006328B-page 33
A.3 BOARD – SCHEMATIC CONNECTORS
S1
GND
10k
0402
R3
GND
GND
GNDGND
4.7uF
16V
0603
C3 100k
1%
R1
GND
GND
USB_P
USB_N
ID 4
VBUS 1
GND 5
D- 2
D+ 3
0
J2
10k
0402
5%
R2
MCU_VCC RESET
SWCLK
SWDIO
USB_VCC
BAT_VCC
MCU_VCCUSB_VCCBAT_VCC MCU_VCC
SWDIO
SWCLK
RESET
S
USB
P_GND
USB_N
USB_P USB
10000pF
50V
0402
C4
4.7uF
10V
0402
C5
12
HDR-2 Male 1x2
J1
VSS 1
STAT
2
VBAT 3
VDD
4
CE
5
PROG 6
EP 7
MCP73830
U3
USB_VCC BAT_VCC
10k
0402
R5
GND
GREEN
LD1
GND
1k
0402
0.1%
R6
2k
0402
1%
R7
49.9k
0603
1%
R4
4.7uF
10V
0402
C9
4.7uF
10V
0402
C8
2.2uF
16V
C1
2.2uF
16V
C2
GND
GND
SWDIO
SWCLK
RESET
SMD24
D2
DNP
EN_BAT_CH
VOUT 1
ADJ 2
GND 3
EN
4VIN
5VIN
6
EPAD
7
MIC94325
U2
GND
MCU VCC
D1
PRTR5V0U2X
1
3
5
7
92
4
6
8
10
J3
IN
GND
USB_VCC
IN
1 2 3MH
HDR-1.5 Male 1x3
J6 GND
VIN
1
GND
2
EN
3
NC 4
VOUT 5
MIC5504/3.3V
U1
GND
DS20006328B-page 34
2020-2022 Microchip Technology Inc. and its subsidiaries
A.4 BOARD – SCHEMATIC MCU
6.8pF
C15
6.8pF
C13
GND
GND
4.7uF
0603
C16
0.1uF
0402
C17
GND
GND
GND
GND
GND
GND
GND
4.7uF
0603
C20
GND
0.1uF
0402
C21
4.7uF
0603
C10
GND
0.1uF
0402
C11
0.1uF
0402
C14
GND
USB_P
USB_N
MCU_VCC
MCU_VCC
MCU_VCC
MCU_VCC
1uF
35V
0402
C12
0.1uF
0402
C19
MCU_VCC
GND
SWCLK
SWDIO
RESET
DATA_MISO
DATA_SS1
DATA_MOSI
DATA_SCK
DATA_SS2
DATA SPI
VREF_MOSI
VREF_SCK
VREF_MISO
VREF_SS1
DATA_SS1
DATA_MISO
DATA_SCK
DATA_MOSI
DATA SPI
VREF_SCK
VREF_MOSI
VREF_SS1
VREF_MISO
VREF SPI
VREF SPI
SWDIO
SWCLK
RESET
SWD
SWD
USB_P
USB_N USB
USB
EN_CP
COMP1
COMP2
COMP3
COMP4
VREF_1&2
VREF_3&4
DATA_SS2
10uH
L1
470R@100MHz
FB1
SO
SI/SIO0
5
SCK
6
HOLD
7
VDD
8
SST25PF040
U5
0.1uF
0402
C18
GND
MEM_MOSI
MEM_SCK
MEM_MISO
MEM_SS1
MEM_HOLD
MEM_WP
MEM_HOLD
BLE
BLE_TX
BLE_RX
BLE_RST
BLE_P1_6
BLE_P2_0
BLE
BLE_TX
BLE_RX
BLE_RST
BLE_P1_6
BLE_P2_0
MCU_VCC
BLE_P2_0
EN_BAT
32.768kHz
XC1
PA00
1
PA01
2
PA02
3
PA03
4
PB04
5
PB05
6
GNDANA
7
VDDANA
8
PB06
9
PB07
10
PB08
11
PB09
12
PA04
13
PA05
14
PA06
15
PA07
16
PA08
17
PA09
18
PA10
19
PA11
20
VDDIO
21
GND
22
PB10
23
PB11
24
PB12
25
PB13
26
PB14
27
PB15
28
PA12
29
PA13
30
PA14
31
PA15
32
GND 33
VDDIO 34
PA16 35
PA17 36
PA18 37
PA19 38
PB16 39
PB17 40
PA20 41
PA21 42
PA22 43
USB_SOF/PA23 44
USB_DM/PA24 45
USB_DP/PA25 46
GND 47
VDDIO 48
PB22 49
PB23 50
PA27 51
RESETN 52
VDDCORE 53
GND 54
VSW 55
VDDIN 56
SWDCLK/PA30 57
SWDIO/PA31 58
PB30 59
PB31 60
PB00 61
PB01 62
PB02 63
PB03 64
PAD 65
ATSAML21J18
U4
10k
R29
10k
R28
TS1
TS2
TS1
TS2
GND
GND
TS3
10k
R27
TS3
3
1
2TN2106
M2
LED_CNTRL
LED_CNTRL
GND
LED_CAT
330R
0402
1%
R30
MCU_VCC
LED_CAT
1 2 3 4 5 6MH
FFC/FPC 6P Female 2005290060
J5
2020-2022 Microchip Technology Inc. and its subsidiaries DS20006328B-page 35
A.5 BOARD – SCHEMATIC HV DRIVERS
GND
GND
BAT_VCC
P_GND GND
VPP
GND
VPP
GND
GND
P_GND
GND
GND
GND
MCU_VCC
GND
GND
MCU_VCC
MCU_VCC
MCU_VCC
10uF
0603
C36
10uF
0603
C45
VREF_1&2
VREF_3&4
0.1uF
0402
C35
0.1uF
0402
C44
10k
0402
R15
10k
0402
R20
DATA_MISO
DATA_SCK
DATA_MOSI
DATA_SS1
DATA_SS2
DATA SPI
DATA SPI
DATA_MOSI
DATA_SCK
DATA_MISO
DATA_SS1
DATA_SS2
BAT_VCC
VIN1
VIN2
VIN3
VIN4
VIN1
VIN2
VIN3
VIN4
VREF_MISO
VREF_SS1
VREF_MOSI
VREF_SCK
VREF SPI
VREF_SS1
VREF_MISO
VREF_SCK
VREF_MOSI
VREF SPI
EN_CP
VDD_CP
VDD_CP
GND
GND
GND
GND
COMP1
COMP2
COMP3
COMP4
GND
GND
200k
0402
R24
GND
GND
VDD_CP
GND
VPP
VDD_CP
GND
100pF
25V
0603
C34
1uF
0402
C53
1uF
0402
C49
GND
GND
5.1k
R18
5.1k
R19
10000pF
C39
GND
10000pF
C41
GND
5.1k
R8 10000pF
C26
GND
5.1k
R10
10000pF
C27
GND
VREF_SCK
VREF_MOSI
VREF_MISO
VREF_SS1
DATA_SCK
DATA_MOSI
DATA_MISO
DATA_SS1
DATA_SS2
0R
0603
R12
GND
0.033uF
0402
C50
3300pF
0402
C47
3300pF
0402
C48
COMP1
COMP2
COMP3
COMP4
COMP1
COMP2
COMP3
COMP4
2.2uF
16V
C43
2.2uF
16V
C46
GND
GND
GND
GND
GND
200k
0402
R21
GND
DNP
DNP
DNP
DNP
GND
22uF
10V
0603
C38
22uF
10V
0603
C42
3300pF
16V
0402
C54
3300pF
16V
0402
C55
0.22uF
450V
1210
C52
0.22uF
450V
1210
C40
COMP1
COMP2
COMP3
COMP4
SCK
SDI
SDO
SS
VIN3
VIN4
D_SCK
D_SDI
D_SDO
D_SS1
D_SS2
GND
GND1
GND2
HVOUT3
HVOUT4
VIN1
VIN2
VDD
VPP
150k
0402
1%
R22
150k
0402
1%
R25
VDD 1
CS 2
VREF0 3
VOUT0 4
VOUT1 5
LAT0/HVC
6
VSS
7
SDO
8
SCK
9
SDI
10
MCP48FEB22
U6
VDD 1
CS 2
VREF0 3
VOUT0 4
VOUT1 5
LAT0/HVC
6
VSS
7
SDO
8
SCK
9
SDI
10
MCP48FEB22
U7
7.5M
0603
1%
R9
225k
0402
1%
R23
EN CP
0.22uF
450V
1210
C32
2.2uF
16V
0402
C37
2.2uF
16V
0402
C51
0.01uF
450V
0805
C33
0.01uF
450V
0805
C56
0.01uF
450V
0805
C57
0.01uF
450V
0805
C58
0.01uF
450V
0805
C59
HVGND
1
CPP2+
2
CPP2-
3
CPP1+
4
CPP1-
5
VIN
6
VLL
7
SCK
8
SDI
9
SDO
10
SS
11
HVGND
12
RT
13
TON
14
SHDN
15
VIN0
16
VIN1
17
HVGND
18
RBIAS
19
TIMER0
20
COMP0
21
TIMER1
22
COMP1
23
VCC 24
HVOUT1 25
VPP 26
HVOUT0 27
HVGND
28
D29
D30
D31
D32
S33
S34
S35
S36
D37
SHT+ 38
SHT- 39
FB 40
EN_CP
41
VDD 42
PGND 43
HVGND
44
D45
HV56020T
U8
VLL
1
SHDN
2
VIN0
3
VIN1
4
HVGND
5
RBIAS
6
TIMER0
7
COMP0
8
TIMER1
9
COMP1
10
VCC 11
HVGND
12
HVOUT1 13
VPP 14
HVOUT0 15
HVGND
16
NC 17
NC 18
NC 19
NC 20
PAD
21
HV56022T
U9
0.003R
0805
1%
R16
39.2k
0603
1%
R11
D5
BYM07-300
D3
100uF
16V
1210
C28
100uF
16V
1210
C29
1 3
L2A
24
L2B
DNP
1k
0603
0.1%
R32
100R
0402
1%
R31
D4
DS20006328B-page 36
2020-2022 Microchip Technology Inc. and its subsidiaries
A.6 BOARD – SCHEMATIC BLE
Schematic and Layouts
2020-2022 Microchip Technology Inc. and its subsidiaries DS20006328B-page 37
A.7 BOARD – TOP LAYER AND SILK
A.8 BOARD – MID-LAYER 1
HV56020/22 Evaluation Board User’s Guide
DS20006328B-page 38
2020-2022 Microchip Technology Inc. and its subsidiaries
A.9 BOARD – GROUND PLANE
A.10 BOARD – POWER PLANE
Schematic and Layouts
2020-2022 Microchip Technology Inc. and its subsidiaries DS20006328B-page 39
A.11 BOARD – MID-LAYER 2
A.12 BOARD – BOTTOM LAYER AND SILK
HV56020/22 Evaluation Board User’s Guide
DS20006328B-page 40
2020-2022 Microchip Technology Inc. and its subsidiaries
NOTES:
Bill of Materials (BOM)
2020-2022 Microchip Technology Inc. and its subsidiaries DS20006328B-page 43
4 R8, R10, R18,
R19
Resistor, TKF, 5.1k, 1%, 1/10W,
SMD, 0402
Panasonic - ECG ERJ-2RKF5101X
1 R9 Resistor, TKF, 7.5M, 1%, 1/10W,
SMD, 0603
ROHM Semiconductor KTR03EZPF7504
1 R11 Resistor, TKF, 39.2k, 1%, 1/10W
SMD, 0603
Stackpole Electronics, Inc. RMCF0603FT39K2
1 R12 Resistor, TKF, 0R, 1/10W, SMD,
0603
Panasonic - ECG ERJ-3GEY0R00V
1 R13 Resistor, TKF, 3.3k, 5%, 1/10W
SMD, 0603
Panasonic - ECG ERJ-3GEYJ332V
1 R14 Resistor, TKF, 10M, 1%, 1/10W,
SMD, 0603 HV, AEC-Q200
ROHM Semiconductor KTR03EZPF1005
1 R16 Resistor, Shunt, 0.003R, 1%,
1/2W, 0805, AEC-Q200
ROHM Semiconductor PMR10EZPFV3L00
1 R17 Resistor, TKF, 499k, 1%, 1/10W,
SMD, 0603
Panasonic - ECG ERJ-3EKF4993V
2 R21, R24 Resistor, TKF, 200k, 1%, 1/10W,
SMD, 0402
Panasonic - ECG ERJ-2RKF2003X
2 R22, R25 Resistor, TKF, 150k, 1%, 1/10W,
SMD, 0402
Panasonic - ECG ERJ-2RKF1503X
1 R23 Resistor, TKF, 225k, 1%, 1/16W,
SMD, 0402
Stackpole Electronics, Inc. RMCF0402FT255K
1 R26 Resistor, TKF, 4.7k, 5%, 1/10W,
SMD, 0603
Panasonic - ECG ERJ-3GEYJ472V
3 R27, R28, R29 Resistor, TKF, 10k, 5%, 1/10W,
SMD, 0402
Panasonic - ECG ERJ-2GEJ103X
1 R30 Resistor, TKF, 330R, 1%,1/10W,
SMD, 0402
KOA Speer Electronics,
Inc.
RK73H1ETTP3300F
1 R31 Resistor, TKF, 100R, 1%, 1/10W,
SMD, 0402
Panasonic - ECG ERJ-2RKF1000X
1 S1 Switch Slide, SPDT, 4V, 0.3A,
MLL1200S
TE Connectivity
Alcoswitch
MLL1200S
1 XC1 Crystal, 32.768 kHz, 7 pF, SMD
CM7V-T1A
Micro Crystal CM7V-T1A 32.768 kHz
7.0 pf +/- 20 ppm
TABLE B-1: BILL OF MATERIAL (BOM) (CONTINUED)
Qty. Reference Description Manufacturer Part Number
Note 1: The components listed in this Bill of Materials are representative of the PCB assembly. The released BOM
used in manufacturing uses all RoHS-compliant components.
HV56020/22 Evaluation Board User’s Guide
DS20006328B-page 44
2020-2022 Microchip Technology Inc. and its subsidiaries
TABLE B-2: BILL OF MATERIALS (BOM) – MICROCHIP PARTS
TABLE B-3: BILL OF MATERIALS (BOM) – MECHANICAL PARTS
TABLE B-4: BILL OF MATERIALS (BOM) – DO NOT POPULATE PARTS
Qty Reference Description Manufacturer Part Number
1 B1 RF Bluetooth, RN4871-I/RM130 Microchip Technology Inc. RN4871-I/RM130
2 M1, M2 Analog MOSFET, N-CH, TN2106,
60V, 280 mA, 360 mW, 2.5R,
SOT23-3
Microchip Technology Inc. TN2106K1-G
1 U1 Analog LDO, 3.3V, 300 mA,
MIC5504-3.3YM5-TR, SOT23-5
Microchip Technology Inc. MIC5504-3.3YM5-TR
1 U2 Analog LDO, ADJ,
MIC94325YMT-TR, TDFN-6
Microchip Technology Inc. MIC94325YMT-TR
1 U3 Analog Battery Charger,
MCP73830T-2AAI/MYY, TDFN-6
Microchip Technology Inc. MCP73830T-2AAI/MYY
1 U4 MCU 32-bit, 48 MHz, 256 kB,
32 kB, ATSAML21J18B-MNT,
QFN-64
Microchip Technology Inc. ATSAML21J18B-MNT
1 U5 Memory Serial Flash, 4 Mb,
40 MHz, SST25PF040CT-40I/NP,
8-UDFN (2x3)
Microchip Technology Inc. SST25PF040CT-40I/NP
2 U6, U7 Analog DAC, 2-Ch, 12-Bit,
MCP48FEB22-E/UN, MSOP-10
Microchip Technology Inc. MCP48FEB22-E/UN
1 U8 Analog HV Driver, 2-Ch,
HV56020T-V/KXX, QFN-43
Microchip Technology Inc. HV56020T-V/KXX
1 U9 Analog HV Driver, 2-Ch,
HV56022T-V/KNX, QFN-20
Microchip Technology Inc. HV56022T-V/KNX
Note 1: The components listed in this Bill of Materials are representative of the PCB assembly. The released BOM
used in manufacturing uses all RoHS-compliant components.
Qty Reference Description Manufacturer Part Number
1 LABEL1 Label PCBA, 18x6 mm, Bar-
Code-AssyID-Rev-Serno
— —
4 PAD1, PAD2,
PAD3, PAD4
Hardware Rubber Pad,
Cylindrical, D7.9, H5.3, Black
3M SJ61A11
Note 1: The components listed in this Bill of Materials are representative of the PCB assembly. The released BOM
used in manufacturing uses all RoHS-compliant components.
Qty Reference Description Manufacturer Part Number
4 C56, C57, C58,
C59
Capacitor, Ceramic, 0.01 µF,
450V, 10%, X7T, SMD, 0805,
AEC-Q200
TDK Corporation CGA4F4X7T2W103M085AE
1 J3 Connector Tag, 10P, TC2050,
SMT, No legs
Tag-Connect LLC TC2050-IDC-NL
1 R5 Resistor, TKF, 10k, 5%, 1/16W,
SMD, 0402
Vishay/Dale CRCW040210K0JNED
1 R32 Resistor, TF, 1k, 0.1%, 1/10W,
SMD, 0603
Panasonic - ECG ERA-3AEB102V
Note 1: The components listed in this Bill of Materials are representative of the PCB assembly. The released BOM
used in manufacturing uses all RoHS-compliant components.
HV56020/22
EVALUATION BOARD
USER’S GUIDE
2020-2022 Microchip Technology Inc. and its subsidiaries DS20006328B-page 45
Appendix C. Waveforms
C.1 INTRODUCTION
This appendix contains the waveforms obtained from the HV56020/22 Evaluation
Board. DataFile.wav was used for the first four waveforms, using Windows® 10 Haptic
Bridge Application. Waveforms 1 to 6 are generated using the Android™ BLE Applica-
tion.
•DataFile HVOUT1.
•DataFile HVOUT2.
•DataFile HVOUT3.
•DataFile HVOUT4.
•Waveform 1, HVOUT1.
•Waveform 2, HVOUT1.
•Waveform 3, HVOUT1.
•Waveform 4, HVOUT1.
•Waveform 5, HVOUT1.
•Waveform 6, HVOUT1.
HV56020/22 Evaluation Board User’s Guide
DS20006328B-page 48
2020-2022 Microchip Technology Inc. and its subsidiaries
FIGURE C-5: Waveform 1, HVOUT1.
FIGURE C-6: Waveform 2, HVOUT1.
Amplitude: 50V/div VPP = 225V
Time: 100 ms/div
Amplitude: 50V/div VPP = 225V
Time: 100 ms/div

Product specificaties

Merk: Microchip
Categorie: Niet gecategoriseerd
Model: HV56020

Heb je hulp nodig?

Als je hulp nodig hebt met Microchip HV56020 stel dan hieronder een vraag en andere gebruikers zullen je antwoorden


Handleiding Niet gecategoriseerd Microchip

Microchip

Microchip MCP4902 Handleiding

11 Maart 2025
Microchip

Microchip ATA6574 Handleiding

11 Maart 2025
Microchip

Microchip mcp42010 Handleiding

25 Februari 2025
Microchip

Microchip MCP47CVB04 Handleiding

25 Februari 2025
Microchip

Microchip WFI32E04UC Handleiding

25 Februari 2025
Microchip

Microchip mcp42050 Handleiding

25 Februari 2025
Microchip

Microchip MCP47CVB14 Handleiding

25 Februari 2025
Microchip

Microchip MCP48CMB08 Handleiding

25 Februari 2025
Microchip

Microchip MCP47CVB28 Handleiding

25 Februari 2025
Microchip

Microchip MCP48FVB18 Handleiding

25 Februari 2025

Handleiding Niet gecategoriseerd

Nieuwste handleidingen voor Niet gecategoriseerd

Tunturi

Tunturi Signature T80 Handleiding

17 Maart 2025
Klein Tools

Klein Tools 34056 Handleiding

17 Maart 2025
StarTech.com

StarTech.com 1P1FFC-USB-SERIAL Handleiding

17 Maart 2025
StarTech.com

StarTech.com P2ADD121D-KVM-SWITCH Handleiding

17 Maart 2025
Strong

Strong LEAP-NEVE Handleiding

17 Maart 2025
Allibert

Allibert Oslo 826172 Handleiding

17 Maart 2025
Allibert

Allibert Oslo 826174 Handleiding

17 Maart 2025
Foppapedretti

Foppapedretti Stendipiu Handleiding

17 Maart 2025
Tascam

Tascam Audio File Manager Handleiding

17 Maart 2025
Vonroc

Vonroc S_PT501XX Handleiding

17 Maart 2025