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and its subsidiaries

Data Sheet DS40002250B-page 1

ATECC608B-TNGTLS

ATECC608B-TNGTLS CryptoAuthentication™ Data Sheet

Introduction

The ATECC608B-TNGTLS is a pre-provisioned variant of the ATECC608B. The ATECC608B provides enhanced

security measures over that of the ATECC608A. These enhancements also apply to the ATECC608B-TNGTLS.

The Trust&GO secure element is part of Microchip’s family of generically provisioned security-focused devices. The

device configuration was designed to make the secure element applicable to some of the most common use cases in

the IoT market, while minimizing the learning and start-up curves associated with security devices.

This data sheet provides the slot and key configuration information that is unique to the ATECC608B-TNGTLS.

This information clearly defines the access policies of each of the data zone slots. Only relevant command and I/O

operating information has been included. An application section discussing Microchip’s hardware and software tools

that can aid in developing an application is also provided with additional links to the location of the tools.

Features

• Fully Specified Configuration Zone

• I2C Interface with One-Time Changeable I2C Address

• One Permanent Primary P-256 Elliptic Curve Cryptography (ECC secp256r1) Private Key Fixed at

Manufacturing Time

• One Internal Sign Private Key for Key Attestation

• Three Secondary P-256 ECC Private Keys that Can Be Regenerated by the User

• Signer Public Key from Signer Certificate

• IO Protection Key Slot to Protect I2C Communication

• ECDH/KDF Key Slot Capable of Being Used with AES Keys and Commands

• X.509 Compressed Certificate Storage

• Available in 8-Pad UDFN and 8-Pin SOIC Packages in 2k or 100 unit production quantities.

Use Cases

• Secure IoT TLS 1.2 and 1.3 Connections

ATECC608B-TNGTLS

and its subsidiaries

Data Sheet DS40002250B-page 2

Table of Contents

Introduction.....................................................................................................................................................1

Features......................................................................................................................................................... 1

Use Cases......................................................................................................................................................1

1. Pin Configuration and Pinouts.................................................................................................................5

2. EEPROM Memory and Data Zone Access Policies................................................................................6

2.1. ATECC608B-TNGTLS Configuration Zone.................................................................................. 7

2.1.1. Modifiable Configuration Zone Bytes.............................................................................7

2.2. Data Zone and Access Policies....................................................................................................8

2.2.1. Data Zone Data Types...................................................................................................8

2.2.1.1. Private Keys................................................................................................ 8

2.2.1.2. Public Keys..................................................................................................9

2.2.1.3. Certificate Storage.......................................................................................9

2.2.1.4. AES Key Storage........................................................................................ 9

2.2.1.5. I/O Protection Key..................................................................................... 10

2.2.1.6. MAC Address............................................................................................ 10

2.2.1.7. General Data Storage................................................................................11

2.2.2. Slot Configuration Terminology.................................................................................... 11

2.2.3. ATECC608B-TNGTLS Slot Configuration Summary................................................... 11

2.2.4. ATECC608B-TNGTLS Detailed Slot Access Policies..................................................12

2.3. ATECC608B-TNGTLS EEPROM One Time Programmable (OTP) Zone..................................14

3. Static RAM (SRAM) Memory................................................................................................................ 16

4. General Command Information.............................................................................................................17

4.1. I/O Transactions......................................................................................................................... 17

4.2. Command Packets.....................................................................................................................17

4.3. Status/Error Codes.....................................................................................................................18

4.4. Address Encoding...................................................................................................................... 19

4.4.1. Configuration Zone Addressing................................................................................... 19

4.4.2. OTP Zone Addressing................................................................................................. 19

4.4.3. Data Zone Addressing.................................................................................................19

4.5. Formatting of Keys, Signatures and Certificates........................................................................21

4.5.1. ECC Key Formatting....................................................................................................21

4.5.1.1. Public Key Formats................................................................................... 21

4.5.2. Signature Format.........................................................................................................22

4.5.3. Certificate Storage....................................................................................................... 22

5. Device Commands................................................................................................................................24

5.1. General Device Commands....................................................................................................... 25

5.1.1. Command....................................................................................................25Counter

5.1.2. Command...........................................................................................................25Info

5.1.3. Command...........................................................................................................26Lock

5.1.4. Command........................................................................................................ 26Nonce

5.1.5. Command...................................................................................................... 26Random

ATECC608B-TNGTLS

and its subsidiaries

Data Sheet DS40002250B-page 3

5.1.6. Command...........................................................................................................26Read

5.1.7. Command..................................................................................................26SelfTest

5.1.8. Command.............................................................................................................26SHA

5.1.9. Command........................................................................................... 26UpdateExtra

5.1.10. Command........................................................................................................ 26Write

5.2. Asymmetric Cryptography Commands.......................................................................................27

5.2.1. Command...........................................................................................................27ECDH

5.2.2. Command...................................................................................................... 27GenKey

5.2.3. Command...........................................................................................................27Sign

5.2.4. Command...................................................................................................... 27Verify

5.3. Symmetric Cryptography Commands........................................................................................ 27

5.3.1. Command.............................................................................................................28AES

5.3.2. Command..................................................................................................28CheckMac

5.3.3. Command...................................................................................................... 28GenDig

5.3.4. Command.............................................................................................................28KDF

5.3.5. Command.............................................................................................................29MAC

6. Application Information..........................................................................................................................30

6.1. Use Cases..................................................................................................................................30

6.2. Development Tools.....................................................................................................................30

6.2.1. Trust Platform Design Suite.........................................................................................30

6.2.2. Hardware Tools............................................................................................................31

6.2.3. CryptoAuthLib..............................................................................................................31

6.3. TrustFLEX vs. Trust&GO............................................................................................................32

7. I2C Interface.......................................................................................................................................... 33

7.1. I/O Conditions.............................................................................................................................33

7.1.1. Device is Asleep.......................................................................................................... 33

7.1.2. Device is Awake.......................................................................................................... 34

7.2. I2C Transmission to ATECC608B-TNGTLS............................................................................... 35

7.2.1. Word Address Values.................................................................................................. 36

7.2.2. I2C Synchronization..................................................................................................... 36

7.3. Sleep Sequence.........................................................................................................................37

7.4. Idle Sequence............................................................................................................................ 37

7.5. I2C Transmission from the ATECC608B-TNGTLS..................................................................... 37

8. Electrical Characteristics.......................................................................................................................38

8.1. Absolute Maximum Ratings........................................................................................................38

8.2. Reliability....................................................................................................................................38

8.3. AC Parameters: All I/O Interfaces.............................................................................................. 38

8.3.1. AC Parameters: I2C Interface...................................................................................... 39

8.4. DC Parameters: All I/O Interfaces..............................................................................................40

8.4.1. VIH and VIL Specifications............................................................................................41

9. Compatibility..........................................................................................................................................43

10. Package Drawings................................................................................................................................ 44

10.1. Package Marking Information.....................................................................................................44