Intel Core 2 Quad Q6700 Handleiding

Intel Processor Core 2 Quad Q6700

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Document Number: 315592-005

Intel® Core™2 Extreme Quad-Core

Processor QX6000Δ Sequence and

Intel® Core™2 Quad Processor

Q6000Δ Sequence

Datasheet

—on 65 nm Process in the 775-land LGA Package supporting

Intel® 64 architecture and Intel® Virtualization Technology±

August 2007

2 Datasheet

INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR

OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT AS PROVIDED IN INTEL'S TERMS AND CONDITIONS

OF SALE FOR SUCH PRODUCTS, INTEL ASSUMES NO LIABILITY WHATSOEVER, AND INTEL DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY, RELATING

TO SALE AND/OR USE OF INTEL PRODUCTS INCLUDING LIABILITY OR WARRANTIES RELATING TO FITNESS FOR A PARTICULAR PURPOSE,

MERCHANTABILITY, OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. INTEL PRODUCTS ARE NOT

INTENDED FOR USE IN MEDICAL, LIFE SAVING, OR LIFE SUSTAINING APPLICATIONS.

Intel may make changes to specifications and product descriptions at any time, without notice.

Designers must not rely on the absence or characteristics of any features or instructions marked "reserved" or "undefined." Intel reserves these for

future definition and shall have no responsibility whatsoever for conflicts or incompatibilities arising from future changes to them.

The Intel® Core™2 Extreme quad-core processor QX6000 sequence and Intel

® Core™2 quad processor Q6000 sequence may contain design defects or

errors known as errata which may cause the product to deviate from published specifications.

Contact your local Intel sales office or your distributor to obtain the latest specifications and before placing your product order.

ΔIntel processor numbers are not a measure of performance. Processor numbers differentiate features within each processor family, not across different

processor families. See http://www.intel.com/products/processor_number for details. Over time processor numbers will increment based on changes in

clock, speed, cache, FSB, or other features, and increments are not intended to represent proportional or quantitative increases in any particular

feature. Current roadmap processor number progression is not necessarily representative of future roadmaps. See www.intel.com/products/

processor_number for details.

Intel® 64 requires a computer system with a processor, chipset, BIOS, operating system, device drivers, and applications enabled for Intel 64. Processor

will not operate (including 32-bit operation) without an Intel 64-enabled BIOS. Performance will vary depending on your hardware and software

configurations. See http://www.intel.com/technology/intel64/index.htm for more information including details on which processors support Intel 64, or

consult with your system vendor for more information.

Enabling Execute Disable Bit functionality requires a PC with a processor with Execute Disable Bit capability and a supporting operating system. Check

with your PC manufacturer on whether your system delivers Execute Disable Bit functionality.

Intel® Virtualization Technology requires a computer system with an enabled Intel

® processor, BIOS, virtual machine monitor (VMM) and, for some

uses, certain platform software enabled for it. Functionality, performance or other benefits will vary depending on hardware and software configurations

and may require a BIOS update. Software applications may not be compatible with all operating systems. Please check with your application vendor.

Intel, Pentium, Itanium, Xeon, Intel SpeedStep, andand the Intel logo are trademarks of Intel Corporation in the U.S. and other countries..

*Other names and brands may be claimed as the property of others.

Datasheet 3

Contents

1 Introduction ..............................................................................................................9

1.1 Terminology .......................................................................................................9

1.1.1 Processor Terminology ............................................................................ 10

1.2 References ....................................................................................................... 11

2 Electrical Specifications ........................................................................................... 13

2.1 Power and Ground Lands.................................................................................... 13

2.2 Decoupling Guidelines........................................................................................ 13

2.2.1 VCC Decoupling ..................................................................................... 13

2.2.2 VTT Decoupling...................................................................................... 13

2.2.3 FSB Decoupling...................................................................................... 14

2.3 Voltage Identification......................................................................................... 14

2.4 Reserved, Unused, and TESTHI Signals ................................................................ 16

2.5 Voltage and Current Specification ........................................................................ 17

2.5.1 Absolute Maximum and Minimum Ratings .................................................. 17

2.5.2 DC Voltage and Current Specification ........................................................ 18

2.5.3 VCC Overshoot ...................................................................................... 21

2.5.4 Die Voltage Validation............................................................................. 21

2.6 Signaling Specifications...................................................................................... 22

2.6.1 FSB Signal Groups.................................................................................. 22

2.6.2 CMOS and Open Drain Signals ................................................................. 24

2.6.3 Processor DC Specifications ..................................................................... 24

2.6.3.1 GTL+ Front Side Bus Specifications ............................................. 26

2.7 Clock Specifications ........................................................................................... 26

2.7.1 Front Side Bus Clock (BCLK[1:0]) and Processor Clocking ............................ 26

2.7.2 FSB Frequency Select Signals (BSEL[2:0])................................................. 27

2.7.3 Phase Lock Loop (PLL) and Filter .............................................................. 27

2.7.4 BCLK[1:0] Specifications ......................................................................... 28

3 Package Mechanical Specifications .......................................................................... 31

3.1 Package Mechanical Drawing............................................................................... 31

3.2 Processor Component Keep-Out Zones................................................................. 35

3.3 Package Loading Specifications ........................................................................... 35

3.4 Package Handling Guidelines............................................................................... 35

3.5 Package Insertion Specifications.......................................................................... 36

3.6 Processor Mass Specification............................................................................... 36

3.7 Processor Materials............................................................................................ 36

3.8 Processor Markings............................................................................................ 36

3.9 Processor Land Coordinates ................................................................................ 38

4 Land Listing and Signal Descriptions ....................................................................... 39

4.1 Processor Land Assignments ............................................................................... 39

4.2 Alphabetical Signals Reference ............................................................................ 62

5 Thermal Specifications and Design Considerations .................................................. 71

5.1 Processor Thermal Specifications ......................................................................... 71

5.1.1 Thermal Specifications ............................................................................ 71

5.1.2 Thermal Metrology ................................................................................. 76

5.2 Processor Thermal Features................................................................................ 76

5.2.1 Thermal Monitor..................................................................................... 76

5.2.2 Thermal Monitor 2.................................................................................. 77

5.2.3 On-Demand Mode .................................................................................. 78

5.2.4 PROCHOT# Signal .................................................................................. 79

Product specificaties

Merk:	Intel
Categorie:	Processor
Model:	Core 2 Quad Q6700
Type verpakking:	Retaildoos
Maximale temperatuur (in bedrijf):	62.2 °C
Processorfamilie:	Intel® Core™2 Quad
Processormodel:	Q6700
Aantal processorkernen:	4
Processor lithografie:	65 nm
Processor socket:	LGA 775 (Socket T)
Stepping:	G0
Processor aantal threads:	4
Processor operating modes:	64-bit
Processor cache:	8 MB
Bus type:	FSB
Thermal Design Power (TDP):	105 W
Processor cache type:	L2
Processorfabrikant:	Intel
Intel® Hyper Threading Technology (Intel® HT Technology):	Nee
Intel® Turbo Boost Technology:	Nee
Intel® AES New Instructions (Intel® AES-NI):	Nee
Enhanced Intel SpeedStep Technology:	Ja
Execute Disable Bit:	Ja
Idle States:	Ja
Thermal Monitoring Technologies:	Ja
Intel® Enhanced Halt State:	Ja
Ingebouwde opties beschikbaar:	Nee
Intel® 64:	Ja
Intel® Virtualization Technology (VT-x):	Ja
Verpakkingsgrootte processor:	37.5 x 37.5 mm
ARK ID processor:	30790
Intel® Trusted Execution Technology:	Nee
Processorcode:	SLACQ
Export Control Classification Number (ECCN):	3A991.A.1
CPU multiplier (bus/core ratio):	10
FSB Parity:	Nee
Front-side bus processor:	1066 MHz
Processing die grootte:	286 mm²
Tcase:	62.2 °C
Aantal Processing Die Transistors:	582 M
Intel® Demand Based Switching:	Nee
Type product:	Processor
Code geharmoniseerd systeem (HS):	8542310001
Basisfrequentie processor:	2.66 GHz
VID Voltage Range:	0.85 - 1.5 V
Commodity Classification Automated Tracking System (CCATS):	NA
Box:	Ja
L2-cache snelheid:	2.66 GHz
Marktsegment:	Desktop
Lanceringsdatum:	Q3'07
Status:	Discontinued
Processorcache:	8192 KB
Productfamilie:	Intel Core Processors
Laatste wijziging:	63903513
Inclusief koeler:	Ja
Merknaam processor:	Intel® Core™2 Quad
Bandbreedte bus:	1066
Type buseenheden:	MHz
Bussnelheid:	1066 MHz